公开(公告)号：US20230288811A1

公开(公告)日：2023-09-14

申请号：US18310704

申请日：2023-05-02

Applicant: SEMES CO, LTD.

Inventor： Moon Hyung BAE ,  Hye Bin BAEK ,  Youngseo AN ,  Euntark LEE ,  Min Jung PARK ,  Seunghan LEE ,  Jung-Hyun LEE

IPC: G03F7/16 ,  H01L21/687 ,  H01L21/67

CPC classification number: G03F7/167 ,  H01L21/68742 ,  H01L21/67017 ,  H01L21/67103

Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.

公开(公告)号：US20210134620A1

公开(公告)日：2021-05-06

申请号：US17088143

申请日：2020-11-03

Applicant: SEMES CO., LTD.

Inventor： Seunghan LEE ,  Jong Seok SEO ,  Euntark LEE ,  Jaeoh BANG ,  Sukhwan CHI

IPC: H01L21/67 ,  H05B1/02 ,  F27B17/00 ,  F27D5/00 ,  H05B3/22 ,  G03F7/16

Abstract: Embodiments of the inventive concept provides an apparatus for treating a substrate. An embodiment of the inventive concept comprises a housing having a process space therein; and a supporting unit supporting a substrate in the process space, and the supporting unit comprises a supporting plate supporting the substrate; a heater member provide in the supporting plate and heating the substrate; and a cooling unit provided below the heater member and cooling the supporting plate, the cooling unit comprises a cooling plate spaced apart from the heater member; and a nozzle provided in the cooling plate, and supplying a cooling gas to a bottom surface of the heater member; and a driver moving the cooling plate between a standby position spaced a first distance apart from the heater member and a cooling position spaced a second distance apart from the heater member, the second distance is shorter than the first distance.

公开(公告)号：US20210054507A1

公开(公告)日：2021-02-25

申请号：US16997491

申请日：2020-08-19

Applicant: SEMES CO., LTD.

Inventor： Seunghan LEE ,  Jongsu CHOI ,  Jong Seok SEO ,  Junho SEO ,  Younghun JUNG ,  Kyungjin SEO ,  Jung-Hyun LEE ,  Moon Hyung BAE ,  Sang Jin BAE

IPC: C23C16/455 ,  H01L21/67 ,  C23C16/44

Abstract: An embodiment of the inventive concept provides an apparatus for treating a substrate. The apparatus for treating a substrate includes a chamber having a treating space inside the chamber and a gas inlet unit entering a gas into the treating space. The gas inlet unit includes an introduction pipe through which the gas is entered, and a discharging plate in which a discharging hole discharging the gas entered through the introduction pipe is formed. The discharging hole is arranged such that density for each area of the discharging plate is different.

公开(公告)号：US20210132499A1

公开(公告)日：2021-05-06

申请号：US17084903

申请日：2020-10-30

Applicant: SEMES CO., LTD.

Inventor： Moon Hyung BAE ,  Hye Bin BAEK ,  Youngseo AN ,  Euntark LEE ,  Min Jung PARK ,  Seunghan LEE ,  Jung-Hyun LEE

IPC: G03F7/16 ,  H01L21/687

Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.

公开(公告)号：US20180314158A1

公开(公告)日：2018-11-01

申请号：US15952402

申请日：2018-04-13

Applicant: SEMES CO., LTD.

Inventor： Seunghan LEE

IPC: G03F7/30 ,  B05C5/00 ,  G03F7/16 ,  G03F7/38 ,  G03F7/40

CPC classification number: G03F7/30 ,  B05C5/005 ,  G03F7/16 ,  G03F7/3021 ,  G03F7/38 ,  G03F7/40

Abstract: An apparatus and a method for performing liquid treatment with respect to a substrate are provided. The apparatus includes a substrate supporting unit that supports and rotates the substrate, and a liquid supplying unit that supplies a liquid onto the substrate supported by the substrate supporting unit. The liquid supplying unit includes a nozzle unit that supplies a first treatment liquid and a second treatment liquid, and a moving unit that moves the nozzle unit. The nozzle unit has a first slit discharge port for discharging the first treatment liquid in a liquid curtain manner, a second slit discharge port for discharging the second treatment liquid in the liquid curtain manner, and a wetting liquid discharge port for discharging a pre-wetting liquid. The treatment liquids are selectively supplied depending on films formed on the substrate, thereby easily coping with the substrate having various types of films.