公开(公告)号：US20230415207A1

公开(公告)日：2023-12-28

申请号：US18328203

申请日：2023-06-02

Applicant: SEMES CO., LTD.

Inventor： Sunghun EOM ,  Kangsul KIM ,  Youngjun SON ,  Seongyeol CHOI

IPC: B08B3/12 ,  H01L21/67 ,  H01L21/02

CPC classification number: B08B3/12 ,  H01L21/67057 ,  H01L21/02052

Abstract: An apparatus for cleaning a back side of a substrate may include a cleaning assembly which may include a cleaning solution supply part receiving a cleaning solution and an ultrasonic wave supply part applying an ultrasonic wave to the cleaning solution such that a column of the cleaning solution is formed from the cleaning solution supply part toward the back side of the substrate. The back side of the substrate may be cleaned by contacting the column of the cleaning solution with the back side of the substrate.