公开(公告)号：US20230415207A1

公开(公告)日：2023-12-28

申请号：US18328203

申请日：2023-06-02

Applicant: SEMES CO., LTD.

Inventor： Sunghun EOM ,  Kangsul KIM ,  Youngjun SON ,  Seongyeol CHOI

IPC: B08B3/12 ,  H01L21/67 ,  H01L21/02

CPC classification number: B08B3/12 ,  H01L21/67057 ,  H01L21/02052

Abstract: An apparatus for cleaning a back side of a substrate may include a cleaning assembly which may include a cleaning solution supply part receiving a cleaning solution and an ultrasonic wave supply part applying an ultrasonic wave to the cleaning solution such that a column of the cleaning solution is formed from the cleaning solution supply part toward the back side of the substrate. The back side of the substrate may be cleaned by contacting the column of the cleaning solution with the back side of the substrate.

公开(公告)号：US20240030057A1

公开(公告)日：2024-01-25

申请号：US18296586

申请日：2023-04-06

Applicant: SEMES CO., LTD.

Inventor： Youngjun SON

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68742 ,  H01L21/67103 ,  H01L21/67288 ,  H01L21/6875 ,  H01L21/68757

Abstract: A substrate treating apparatus includes a support plate having a first decompression hole and a second decompression hole in a first surface facing a substrate and including a first decompression flow path connected to the first decompression hole and a second decompression flow path connected to the second decompression hole, a plurality of movable pins protruding from the first surface of the support plate and configured to contact a conductive line according to movement in a first direction, and a controller configured to adjust an order of decompressing the first decompression flow path and the second decompression flow path.

公开(公告)号：US20230207340A1

公开(公告)日：2023-06-29

申请号：US18145327

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Youngjun SON ,  Kisang EUM ,  Wonsik SON

IPC: H01L21/67 ,  H01L21/683 ,  B08B3/02 ,  B08B13/00 ,  G03F7/20

CPC classification number: H01L21/67051 ,  H01L21/6831 ,  B08B3/022 ,  B08B13/00 ,  G03F7/70925

Abstract: A cleaning device for cleaning a rear face of a substrate may include a housing, an electrostatic chuck disposed in the housing wherein the substrate is placed on the electrostatic chuck, at least one adsorption member configured to place the substrate onto the electrostatic chuck, a driving member configured to rotate the electrostatic chuck, a circulation member coupled to the driving member and configured to form a circulating airflow for preventing scattering of a cleaning solution in the housing, at least one auxiliary circulation member disposed adjacent to the circulation member wherein the at least one auxiliary circulation member includes a circulation hole for the circulating airflow, and at least one nozzle disposed adjacent to the at least one auxiliary circulation member and configured to the cleaning solution onto the rear face of the substrate.