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公开(公告)号:US20210057239A1
公开(公告)日:2021-02-25
申请号:US16999836
申请日:2020-08-21
Applicant: SEMES CO., LTD.
Inventor: Junho KIM , Kyungsik SHIN , Youngseo AN , Jinki SHIN , Man Kyu KANG , Yoonki SA
IPC: H01L21/67 , H01L21/683
Abstract: An apparatus for treating a substrate includes a process chamber having a process space therein, a support unit that supports the substrate in the process space, a heating member that heats the substrate supported on the support unit, and an exhaust unit that evacuates the process space. The exhaust unit includes an exhaust duct and a heat retention unit having a retention space that retains heat released from the process space. The retention space surrounds an adjacent area located adjacent to the process chamber in the exhaust duct.
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2.
公开(公告)号:US20180151409A1
公开(公告)日:2018-05-31
申请号:US15823311
申请日:2017-11-27
Applicant: SEMES CO., LTD.
Inventor: Min Woo JO , Cheolmin CHOI , Sanguk PARK , Man Kyu KANG
IPC: H01L21/687
CPC classification number: H01L21/68785 , H01L21/67109 , H01L21/6715 , H01L21/67178 , H01L21/67769 , H01L21/68742 , H01L21/6875
Abstract: Embodiments of the inventive concept relate to a substrate treating apparatus. A substrate support unit configured to support a substrate includes a support plate, on which the substrate is positioned, the support plate may include a passage formed on an upper surface of the support plate and connecting a central area and a side surface of the support plate, and a recess formed in a peripheral area of the support plate and recessed inwards from a side surface of the support plate, and the recess may communicate with one end of the passage.
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