公开(公告)号：US20210118708A1

公开(公告)日：2021-04-22

申请号：US17072501

申请日：2020-10-16

Applicant: SEMES CO., LTD.

Inventor： Kyungsik SHIN ,  Junho KIM ,  Jinki SHIN

IPC: H01L21/67 ,  H01L21/027 ,  H01L21/3105 ,  H01L21/66 ,  F27B17/00 ,  H05B3/22 ,  F27D5/00 ,  G03F7/16

Abstract: An apparatus for treating a substrate includes a process chamber having a process space inside, a support unit that supports the substrate in the process space, a heating unit that is provided inside the support unit and that heats the substrate, an exhaust unit that evacuates the process space, and a gas supply unit that supplies a gas into the process space, and the gas supply unit supplies the gas at a temperature selected from a first temperature and a second temperature.

公开(公告)号：US20210057239A1

公开(公告)日：2021-02-25

申请号：US16999836

申请日：2020-08-21

Applicant: SEMES CO., LTD.

Inventor： Junho KIM ,  Kyungsik SHIN ,  Youngseo AN ,  Jinki SHIN ,  Man Kyu KANG ,  Yoonki SA

IPC: H01L21/67 ,  H01L21/683

Abstract: An apparatus for treating a substrate includes a process chamber having a process space therein, a support unit that supports the substrate in the process space, a heating member that heats the substrate supported on the support unit, and an exhaust unit that evacuates the process space. The exhaust unit includes an exhaust duct and a heat retention unit having a retention space that retains heat released from the process space. The retention space surrounds an adjacent area located adjacent to the process chamber in the exhaust duct.