公开(公告)号：US11149234B2

公开(公告)日：2021-10-19

申请号：US16250069

申请日：2019-01-17

Applicant: Samsung Electronics Co., Ltd. ,  SEMES Co., Ltd.

Inventor： Mi Hyun Park ,  Jung-Min Oh ,  Young-Hoo Kim ,  Hyo San Lee ,  Tae Keun Kim ,  Ye Rim Yeon ,  Hae Rim Oh ,  Ji Soo Jeong ,  Min Hee Cho

IPC: B08B3/10 ,  C11D11/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  C11D17/00 ,  C11D3/28 ,  C11D3/20 ,  C11D3/34 ,  C11D3/32 ,  C11D1/14 ,  C11D1/12 ,  C11D1/29

Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.35.

公开(公告)号：US12159793B2

公开(公告)日：2024-12-03

申请号：US17978328

申请日：2022-11-01

Applicant: SEMES CO., LTD.

Inventor： Min Hee Cho ,  Kyeong Min Lee ,  Won Young Kang ,  Kang Sul Kim ,  Tae-Keun Kim

IPC: H01L21/67 ,  H01L21/02

Abstract: A substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate, and supplying a rinse liquid onto the substrate may be provided.

公开(公告)号：US11925963B2

公开(公告)日：2024-03-12

申请号：US17826729

申请日：2022-05-27

Applicant: SEMES CO., LTD.

Inventor： Kyeong Min Lee ,  Tae-Keun Kim ,  Min Hee Cho ,  Won Young Kang

IPC: B08B7/00 ,  B08B3/10

CPC classification number: B08B7/0014 ,  B08B3/10

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a dissolving solution onto a rotating substrate; and supplying, after the supplying a dissolution solution, a treating liquid including a polymer onto the rotating substrate to form a liquid film.