Apparatus for treating substrate
    1.
    发明授权

    公开(公告)号:US12278119B2

    公开(公告)日:2025-04-15

    申请号:US17837135

    申请日:2022-06-10

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a treating fluid to the inner space; and a fluid exhaust unit configured to exhaust the treating fluid from the inner space, and wherein the fluid exhaust unit includes: an exhaust line connected to the chamber; and a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space to a set pressure, and wherein the fluid supply unit includes: a fluid supply source; and a supply line provided between the fluid supply source and the chamber, and wherein at the supply line or the exhaust line a flow rate measuring member configured to measure a flow rate per unit time of the treating fluid flowing at the inner space is installed.

    Apparatus for treating substrate and temperature control method

    公开(公告)号:US12300517B2

    公开(公告)日:2025-05-13

    申请号:US17547182

    申请日:2021-12-09

    Abstract: The inventive concept provides a temperature controlling method. The temperature controlling method for controlling a temperature of a tank storing a treating fluid transferred to the chamber, comprises supplying the treating fluid to the inner space of the tank, heating the treating fluid at the inner space, and transferring the heated treating fluid to the chamber, wherein the temperature of the inner space is controlled based on a measured pressure of the inner space.

    Apparatus for treating substrate and temperature control method

    公开(公告)号:US12272569B2

    公开(公告)日:2025-04-08

    申请号:US17547182

    申请日:2021-12-09

    Abstract: The inventive concept provides a temperature controlling method. The temperature controlling method for controlling a temperature of a tank storing a treating fluid transferred to the chamber, comprises supplying the treating fluid to the inner space of the tank, heating the treating fluid at the inner space, and transferring the heated treating fluid to the chamber, wherein the temperature of the inner space is controlled based on a measured pressure of the inner space.

    Substrate treating method and substrate treating apparatus

    公开(公告)号:US12094705B2

    公开(公告)日:2024-09-17

    申请号:US17892214

    申请日:2022-08-22

    CPC classification number: H01L21/02101 H01L21/67034 H01L21/67057

    Abstract: Provided is a substrate treating apparatus including: a fluid supply unit supplying a supercritical fluid to the treatment space, a plurality of components installed in the fluid supply line; and a detection member detecting whether or not metal particles are released from the component. The detection member includes: an upstream detection port connected to the fluid supply line upstream from a first component which is one of the plurality of components; a downstream detection port connected to the fluid supply line downstream from the first component; and a detector provided to be coupled to a selected detection port between the upstream detection port and the downstream detection port, and detecting metal particles from a fluid flowing through the detection port from the fluid supply line.

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