公开(公告)号：US20230207266A1

公开(公告)日：2023-06-29

申请号：US18147382

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Ja Myung GU ,  Hyung Joon KIM ,  Sae Won NA

IPC: H01J37/32

CPC classification number: H01J37/32174 ,  H01J37/32642 ,  H01J37/32715

Abstract: Disclosed is a substrate processing apparatus. The substrate processing apparatus includes a chamber having an inner space; a support unit that supports a substrate in the inner space; a ring unit disposed on an edge area of the support unit when viewed from above; a power unit that generates RF power for forming an electric field in the inner space; and a harmonic control unit connected to the ring unit to control harmonics generated by the RF power.