公开(公告)号：US20170110295A1

公开(公告)日：2017-04-20

申请号：US15293393

申请日：2016-10-14

Applicant: SEMES CO., LTD.

Inventor： Seok Won HWANG ,  Kisang Eum ,  Sun Wook Jung

IPC: H01J37/32

CPC classification number: H01J37/32697 ,  H01J37/3244 ,  H01J37/32642 ,  H01J37/3266 ,  H01J37/32724 ,  H01J2237/1502 ,  H01J2237/151 ,  H01J2237/334

Abstract: The inventive concepts provide a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a treatment space is provided, a support unit supporting a substrate in the process chamber, a gas supply unit supplying a gas into the process chamber, and a plasma source generating plasma from the gas. The support unit includes a support plate on which a substrate is loaded, a focus ring disposed to surround the support plate, an electric field adjusting ring disposed under the focus ring, and an actuator vertically moving the electric field adjusting ring.