公开(公告)号：US20250096007A1

公开(公告)日：2025-03-20

申请号：US18882906

申请日：2024-09-12

Applicant: SEMES CO., LTD.

Inventor： Jae Seung YU ,  Sung Hun EOM ,  Hee Man AHN ,  Gyeong Won SONG ,  Gu Won SEON ,  Sol AN

IPC: H01L21/324 ,  G03F7/16 ,  H01L21/033

Abstract: A method of treating a substrate treats a substrate by using a substrate treating apparatus that includes a main supply line connected to a humidified gas supply line and a dry gas supply line, having a first region in which a first heater is installed, and a second region located downstream of the first region. The method includes a heating operation of heating the second region with the dry gas heated in the first region by supplying the dry gas into the main supply line in a state where the first heater is controlled to heat the first region; and a substrate treating operation of supplying the humidified gas into the main supply line after the heating operation and allowing the humidified gas to pass through the first region and the second region and to be supplied into the treatment space to treat the substrate disposed in the treatment space.

公开(公告)号：US20240385524A1

公开(公告)日：2024-11-21

申请号：US18664981

申请日：2024-05-15

Applicant: SEMES CO., LTD.

Inventor： Hee Man AHN ,  Gyeong Won SONG ,  Jae Seung YU ,  Sol AN ,  Sung Hun EOM

IPC: G03F7/16 ,  G03F7/00

Abstract: Disclosed are an apparatus and a method for treating a substrate, and more particularly, an apparatus and a method for heat treating a substrate. The apparatus includes: a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed; a transfer plate positioned within the inner space, and movable between an inner position for loading the substrate into the treatment space or for unloading the substrate from the treatment space and an outer position provided outside the heating unit; and a gas injection unit positioned within the inner space, and for injecting atmosphere gas toward the substrate at the outer position.