-
公开(公告)号:US20240385524A1
公开(公告)日:2024-11-21
申请号:US18664981
申请日:2024-05-15
Applicant: SEMES CO., LTD.
Inventor: Hee Man AHN , Gyeong Won SONG , Jae Seung YU , Sol AN , Sung Hun EOM
Abstract: Disclosed are an apparatus and a method for treating a substrate, and more particularly, an apparatus and a method for heat treating a substrate. The apparatus includes: a heating unit provided in the inner space, and providing a treatment space in which a heating process of the substrate is performed; a transfer plate positioned within the inner space, and movable between an inner position for loading the substrate into the treatment space or for unloading the substrate from the treatment space and an outer position provided outside the heating unit; and a gas injection unit positioned within the inner space, and for injecting atmosphere gas toward the substrate at the outer position.
-
公开(公告)号:US20240213059A1
公开(公告)日:2024-06-27
申请号:US18524726
申请日:2023-11-30
Applicant: SEMES CO., LTD.
Inventor: Hee Man AHN , Sung Hun EOM , Gyeong Won SONG , Jae Seung YU
IPC: H01L21/67 , G03F7/00 , H01L21/673
CPC classification number: H01L21/67225 , G03F7/70033 , H01L21/67023 , H01L21/67098 , H01L21/6732
Abstract: Disclosed are a substrate processing apparatus and method in which in a heat-treatment process such as a baking process, a surrounding humidity environment may be precisely controlled based on photoresist for extreme ultraviolet (EUV) applied on the substrate. The substrate processing apparatus includes a housing having a treatment space defined therein; a support unit for supporting, thereon, a substrate received in the treatment space; and a gas supply unit configured to alternately supply a first gas and a second gas into the treatment space in response to photoresist (PR) for extreme ultraviolet (EUV) applied onto the substrate.
-
公开(公告)号:US20250096007A1
公开(公告)日:2025-03-20
申请号:US18882906
申请日:2024-09-12
Applicant: SEMES CO., LTD.
Inventor: Jae Seung YU , Sung Hun EOM , Hee Man AHN , Gyeong Won SONG , Gu Won SEON , Sol AN
IPC: H01L21/324 , G03F7/16 , H01L21/033
Abstract: A method of treating a substrate treats a substrate by using a substrate treating apparatus that includes a main supply line connected to a humidified gas supply line and a dry gas supply line, having a first region in which a first heater is installed, and a second region located downstream of the first region. The method includes a heating operation of heating the second region with the dry gas heated in the first region by supplying the dry gas into the main supply line in a state where the first heater is controlled to heat the first region; and a substrate treating operation of supplying the humidified gas into the main supply line after the heating operation and allowing the humidified gas to pass through the first region and the second region and to be supplied into the treatment space to treat the substrate disposed in the treatment space.
-
公开(公告)号:US20250062125A1
公开(公告)日:2025-02-20
申请号:US18792771
申请日:2024-08-02
Applicant: SEMES CO., LTD.
Inventor: Gyeong Won SONG , Hee Man AHN , Sung Hun EOM , Jae Seung YU , Gu Won SEON
IPC: H01L21/033 , H01L21/324 , H01L21/67
Abstract: Disclosed is a substrate processing method including: a substrate loading operation of loading a substrate into a processing space provided by a body; a heating operation of placing the substrate, which has been loaded into the processing space, on a heating chuck and heating the substrate; and an atmosphere changing operation of changing an atmosphere of the processing space, in which the atmosphere changing operation includes: a gas discharging operation of injecting atmosphere changing gas in a state where the substrate is located closer to a baffle than in the heating operation, in which the baffle is provided on a top side of the heating chuck to face the heating chuck and injects the atmosphere changing gas; and a substrate lowering operation of lowering and placing the substrate onto the heating chuck while maintaining the injection of the atmosphere changing gas.
-
-
-