PROCESSING LIQUID PROVIDING APPARATUS AND SUBSTRATE TREATING SYSTEM INCLUDING THE SAME

    公开(公告)号:US20230211612A1

    公开(公告)日:2023-07-06

    申请号:US18091187

    申请日:2022-12-29

    CPC classification number: B41J2/17513 G02B5/207

    Abstract: Provided are an apparatus for providing a substrate processing liquid having an optimal structure in the correlation between securing internal agitation fluidity and recovery of sloshing, and a substrate processing system including the same. The apparatus for providing substrate processing liquid comprises a storage tank for storing substrate processing liquid, and a partition wall installed inside the storage tank and for dividing an internal space of the storage tank, wherein the apparatus is connected to a substrate processing apparatus for discharging the substrate processing liquid onto a substrate to provide the substrate processing liquid to the substrate processing apparatus, wherein the partition wall includes a plurality of holes formed passing through one surface and the other surface.

    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20230032943A1

    公开(公告)日:2023-02-02

    申请号:US17845790

    申请日:2022-06-21

    Abstract: Provided are a substrate treating apparatus and a substrate treating method capable of preventing settling of a chemical without using a stirrer. The substrate treating apparatus according to the present disclosure includes: a main tank in which a chemical for supplying to an inkjet head is stored; and a buffer tank including a space for storing the chemical to be supplied to the main tank, including a first outlet through which the chemical is discharged, a first inlet through which the chemical is introduced while forming a closed path with the first outlet so that the chemical is circulated without passing through the main tank, and second outlets for supplying the chemical to the main tank, and including a floor surface including a first vertex and a second vertex disposed to be spaced apart from the first vertex, wherein the first outlet is provided at a position closer to the first vertex than the second vertex, and the first inlet is provided at a position closer to the second vertex than the first vertex.

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