SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20230032943A1

    公开(公告)日:2023-02-02

    申请号:US17845790

    申请日:2022-06-21

    Abstract: Provided are a substrate treating apparatus and a substrate treating method capable of preventing settling of a chemical without using a stirrer. The substrate treating apparatus according to the present disclosure includes: a main tank in which a chemical for supplying to an inkjet head is stored; and a buffer tank including a space for storing the chemical to be supplied to the main tank, including a first outlet through which the chemical is discharged, a first inlet through which the chemical is introduced while forming a closed path with the first outlet so that the chemical is circulated without passing through the main tank, and second outlets for supplying the chemical to the main tank, and including a floor surface including a first vertex and a second vertex disposed to be spaced apart from the first vertex, wherein the first outlet is provided at a position closer to the first vertex than the second vertex, and the first inlet is provided at a position closer to the second vertex than the first vertex.

    INK TREATMENT APPARATUS AND METHOD
    2.
    发明公开

    公开(公告)号:US20240217243A1

    公开(公告)日:2024-07-04

    申请号:US18302323

    申请日:2023-04-18

    CPC classification number: B41J2/17596 B41J29/393

    Abstract: An ink treatment apparatus and method are provided. The ink treatment apparatus includes: a reservoir storing ink; a head module ejecting the ink; a first control valve controlling a flow of the ink; a plurality of fluid transfer lines installed between the reservoir and the head module and having the ink flow therein; a pump installed in the fluid transfer lines to pump the ink; a flow rate measurement module installed in the fluid transfer line, the flow rate measurement module measuring a flow rate of the ink in accordance with the flow of the ink and providing ink flow rate information that is information regarding the flow rate of the ink; and a control module controlling a circulation ratio of the ink between the fluid transfer lines by controlling the pump and the first control valve based on the ink flow rate information.

    PRESSURE CONTROL DEVICE AND SUBSTRATE TREATMENT APPARATUS INCLUDING THE SAME

    公开(公告)号:US20240208211A1

    公开(公告)日:2024-06-27

    申请号:US18182577

    申请日:2023-03-13

    CPC classification number: B41J2/04583 B41J2/14451

    Abstract: Provided is a pressure control device for stably controlling the internal air pressure of a reservoir. The pressure control device includes: an input terminal receiving source air pressure; an intake valve connected between the input terminal and an output terminal; an exhaust valve connected to the output terminal; a pressure sensor connected to the output terminal and generating a sensed value by sensing pressure at the output terminal; and a controller simultaneously operating the intake valve and the exhaust valve by simultaneously operating a first control loop for adjusting the degree of opening of the intake valve by comparing the sensed value with a first target value and a second control loop for adjusting the degree of opening of the exhaust valve by comparing the sensed value with a second target value.

    UNIT FOR SUPPLYING SUBSTRATE TREATING LIQUID AND APPARATUS FOR TREATING SUBSTRATE INCLUDING THE SAME

    公开(公告)号:US20230068426A1

    公开(公告)日:2023-03-02

    申请号:US17879012

    申请日:2022-08-02

    Abstract: A unit for supplying a substrate-treating liquid is provided with a first reservoir and a second reservoir between which a differential pressure is constantly maintained to establish a flow rate, along with a substrate-treating apparatus having the unit for supplying the substrate-treating liquid. The unit for supplying the substrate-treating liquid includes a supply reservoir module and a buffer reservoir module. The supply reservoir module includes a first reservoir for supplying the substrate-treating liquid to an inkjet head unit for jetting the substrate-treating liquid onto a substrate, and a second reservoir for recovering the substrate-treating liquid that remains unused in the inkjet head unit. The buffer reservoir module is configured to provide the substrate-treating liquid to the first reservoir. Differential pressure is constantly maintained between the first reservoir and the second reservoir.

    PROCESSING LIQUID PROVIDING APPARATUS AND SUBSTRATE TREATING SYSTEM INCLUDING THE SAME

    公开(公告)号:US20230211612A1

    公开(公告)日:2023-07-06

    申请号:US18091187

    申请日:2022-12-29

    CPC classification number: B41J2/17513 G02B5/207

    Abstract: Provided are an apparatus for providing a substrate processing liquid having an optimal structure in the correlation between securing internal agitation fluidity and recovery of sloshing, and a substrate processing system including the same. The apparatus for providing substrate processing liquid comprises a storage tank for storing substrate processing liquid, and a partition wall installed inside the storage tank and for dividing an internal space of the storage tank, wherein the apparatus is connected to a substrate processing apparatus for discharging the substrate processing liquid onto a substrate to provide the substrate processing liquid to the substrate processing apparatus, wherein the partition wall includes a plurality of holes formed passing through one surface and the other surface.

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