公开(公告)号：US20220174786A1

公开(公告)日：2022-06-02

申请号：US17531798

申请日：2021-11-21

Applicant: SEMES CO., LTD.

Inventor： Soon Hyun KIM ,  Byung Geun KIM ,  Byoung Chan LEE

IPC: H05B1/02 ,  F28D21/00 ,  H05B3/06 ,  H01L21/67

Abstract: A heater assembly includes a housing having an accommodation space therein and having a cooling gas inlet communicating with the accommodation space, a heater coupled to the housing, and a porous block disposed in the accommodation space.

公开(公告)号：US20240216958A1

公开(公告)日：2024-07-04

申请号：US18395574

申请日：2023-12-24

Applicant: SEMES CO., LTD.

Inventor： Soon Hyun KIM ,  Kyung Min KIM

IPC: B08B3/02 ,  B08B3/08

CPC classification number: B08B3/024 ,  B08B3/08 ,  B08B2203/02

Abstract: Proposed are a substrate treatment apparatus and a substrate treatment method, and a technology capable of reducing a nozzle driving deviation between facilities by feedback a repetitive operation of a nozzle driving cylinder of the substrate treatment apparatus and by correcting an air input flow rate of the nozzle driving cylinder according to an error in the operation of the nozzle driving cylinder is provided.

公开(公告)号：US20240216939A1

公开(公告)日：2024-07-04

申请号：US18343242

申请日：2023-06-28

Applicant: SEMES CO., LTD.

Inventor： Soon Hyun KIM ,  Kyung Min KIM

IPC: B05B13/04 ,  H01L21/67

CPC classification number: B05B13/0421 ,  H01L21/67051 ,  H01L21/6708

Abstract: The inventive concept provides a liquid supply unit which may implement a rotation (swing) of a plurality of nozzles by a single motor, and which has simple structure. The liquid supply unit includes a first nozzle, a second nozzle, a motor, and a first belt. The first nozzle includes a first supply pipe for supplying a liquid, a first rotation part provided at a bottom part of the first supply pipe, and a first electromagnetic clutch provided at a bottom part of the first rotation part. The second nozzle includes a second supply pipe for supplying a liquid, a second rotation part provided at a bottom part of the second supply pipe, and a second electromagnetic clutch provided at a bottom part of the second rotation part. The motor provides a rotation force to the first electromagnetic clutch. The first belt which interlocks a rotation of the first electromagnetic clutch and the second electromagnetic clutch.

公开(公告)号：US20150129135A1

公开(公告)日：2015-05-14

申请号：US14532190

申请日：2014-11-04

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hang Lim LEE ,  Jong Jin WEON ,  Soon Hyun KIM ,  Seung Dae SEOK

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/75301 ,  H01L2224/75305 ,  H01L2224/75312 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2224/81048 ,  H01L2224/81203 ,  H01L2224/83048 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00014

Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

Abstract translation: 公开了具有该键合头的接合头和芯片接合装置。 接合头包括连接到用于传送模具的驱动部分的主体，安装到主体的下表面的板加热器和安装到板加热器的下表面并被构造成使用真空压力保持模具的夹头。 冷却通道形成在主体的下表面，并且冷却通道通过主体形成并与冷却通道连接，以将冷却流体供应到冷却通道中并从冷却通道回收冷却流体，从而冷却板 加热器。