公开(公告)号：US09620476B2

公开(公告)日：2017-04-11

申请号：US14532190

申请日：2014-11-04

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hang Lim Lee ,  Jong Jin Weon ,  Soon Hyun Kim ,  Seung Dae Seok

IPC: B32B37/00 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L24/75 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/75301 ,  H01L2224/75305 ,  H01L2224/75312 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2224/81048 ,  H01L2224/81203 ,  H01L2224/83048 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00014

Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

公开(公告)号：US12082313B2

公开(公告)日：2024-09-03

申请号：US17531798

申请日：2021-11-21

Applicant: SEMES CO., LTD.

Inventor： Soon Hyun Kim ,  Byung Geun Kim ,  Byoung Chan Lee

IPC: H01L21/67 ,  F28D21/00 ,  H01L21/683 ,  H05B1/02 ,  H05B3/06

CPC classification number: H05B1/0233 ,  F28D21/0015 ,  H01L21/67144 ,  H05B3/06 ,  H01L21/6838

Abstract: A heater assembly includes a housing having an accommodation space therein and having a cooling gas inlet communicating with the accommodation space, a heater coupled to the housing, and a porous block disposed in the accommodation space.