APPARATUS FOR TEMPERATURE MEASUREMENT AND METHOD OF PROCESSING SUBSTRATE

    公开(公告)号:US20230083574A1

    公开(公告)日:2023-03-16

    申请号:US17737354

    申请日:2022-05-05

    Abstract: A temperature measuring apparatus with improved accuracy is provided. The temperature measuring apparatus comprises a test substrate having a thermal conductivity, a circuit board layer laminated on the test substrate and including a plurality of through holes exposing a top surface of the test substrate, bonding agent disposed in the plurality of through holes and having a thermal conductivity, and a plurality of sensors disposed on the bonding agent and for measuring a temperature.

Patent Agency Ranking