公开(公告)号：US20240178031A1

公开(公告)日：2024-05-30

申请号：US18382239

申请日：2023-10-20

Applicant: SEMES CO., LTD.

Inventor： Sumi Kim ,  Jaesung Lee

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67742 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67745

Abstract: A substrate processing apparatus includes a plurality of process chambers for processing a substrate, a first transfer robot configured to transfer the substrate and arranged in a first transfer chamber, a second transfer robot configured to transfer the substrate and arranged in a second transfer chamber, and a share module arranged adjacent to the first transfer chamber and the second transfer chamber and configured to receive the substrate from any one of the first transfer robot and the second transfer robot, wherein an inside of each of the first transfer chamber and the second transfer chamber is in a vacuum state, and the first transfer robot and the second transfer robot transfer the substrate in a vacuum state.