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Patent Agency Ranking
公开(公告)号：US20230075120A1
公开(公告)日：2023-03-09
申请号：US17895212
申请日：2022-08-25
Applicant: SEMES CO., LTD.
Inventor： Tae Dong PARK , Chung Woo LEE
Abstract: Provided is a supporting unit supporting a substrate. The supporting unit may include: a plate; heating elements provided to the plate and controlling a temperature of a substrate, wherein the heating elements are arranged to control temperatures of different areas of the substrate; and a power supply module supplying power to the heating element, and the power supply module may be configured to continuously supply the power to at least two heating elements of the heating elements.
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公开(公告)号：US20230070679A1
公开(公告)日：2023-03-09
申请号：US17895266
申请日：2022-08-25
Applicant: SEMES CO., LTD.
Inventor： Tae Dong PARK , Chung Woo LEE
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; and a support unit configured to support and heat a substrate in the treating space, and wherein the support unit includes: at least one heating element for adjusting a temperature of the substrate; a power source for generating a power applied to at least one heating element; a power supply line for transmitting the power generated by the power source to the at least one heating element; a power return line for grounding the at least one heating element; and a current measuring resistor provided on the power supply line or the power return line and used for estimating a temperature of the at least one heating element.
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公开(公告)号：US20230067873A1
公开(公告)日：2023-03-02
申请号：US17890395
申请日：2022-08-18
Applicant: SEMES CO., LTD.
Inventor： Chung Woo LEE , Chang Jun PARK , Tae Dong PARK
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an entrance for taking in and taking out a substrate at a side wall; a support unit provided inside of the chamber and supporting the substrate; an imaging unit for imaging a substrate being taken in by a transfer robot through the entrance; and a controller is configured to control a position of the transfer robot based on an image data from the imaging unit.
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4.发明公开公开(公告)号：US20230194239A1
公开(公告)日：2023-06-22
申请号：US18082572
申请日：2022-12-15
Applicant: SEMES CO., LTD.
Inventor： Chung Woo LEE , Tae Dong PARK , Chang Jun PARK , Jin Hwan KIM
CPC classification number: G01B11/002 , H01L21/67259 , G01B11/14 , H01L21/6831
Abstract: Proposed are a wafer position detection apparatus and a wafer position detection and correction method using the same. More specifically, proposed is an apparatus for wafer placement teaching for adjusting a position of a wafer disposed on an electrostatic chuck, the apparatus including a laser distance sensor disposed above the electrostatic chuck, and a controller configured to control a robot configured to transfer the wafer. The controller checks a relative position of the electrostatic chuck and the wafer disposed on the electrostatic chuck using the laser distance sensor so that the wafer is transferred to a predetermined position, and teaches the position of the wafer using the checked relative position of the electrostatic chuck and the wafer.
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公开(公告)号：US20230060901A1
公开(公告)日：2023-03-02
申请号：US17892244
申请日：2022-08-22
Applicant: SEMES CO., LTD.
Inventor： Tae Dong PARK , Chung Woo LEE
Abstract: The inventive concept provides a support unit for supporting a substrate. The support unit for supporting the substrate includes a first plate; heating elements provided at the first plate for controlling a temperature of respective region of the substrate; a power supply module configured to generate at least two powers having a different frequency; a power line transmitting a power generated by the power supply module to the heating elements; and filters installed at the power line to selectively filter a power supplied to the heating elements.
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