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公开(公告)号：US20240213041A1
公开(公告)日：2024-06-27
申请号：US18543499
申请日：2023-12-18
Applicant: SEMES CO., LTD.
Inventor： Taeshin KIM , Youngdae CHUNG , Chengyeh HSU , Thomas Jongwan KWON
CPC classification number: H01L21/67017 , C23C16/483
Abstract: A substrate processing device includes a substrate support portion supporting a substrate, a fluid supply portion arranged above the substrate support portion and configured to supply an initiator and a monomer toward the substrate, and a laser generation portion configured to irradiate a laser in a direction intersecting a direction in which the initiator and the monomer are supplied and parallel to a surface of the substrate, wherein the initiator and the monomer are polymerized by the laser and deposited on the substrate.
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