公开(公告)号：US20240393705A1

公开(公告)日：2024-11-28

申请号：US18639022

申请日：2024-04-18

Applicant: SEMES CO., LTD.

Inventor： Sang Hyun PARK ,  Seung Hwan LEE ,  Su Jin AHN ,  Geon Yup LIM ,  Jin Ki SHIN ,  Dong Hoon KANG ,  Hyun Soo KIM ,  Kwang Soo KIM ,  Chang Suk OH ,  Young Jun LEE

IPC: G03F7/00 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a substrate processing apparatus in which weight of a buffer module may be reduced compared to the apparatus in the related art. The substrate processing apparatus may include: an index module; a buffer module; a treating module; and an interface module, in which the index module includes: a load port in which a container receiving a substrate is placed; and an index frame provided with an index robot for transferring the substrate between the container placed in the load port and the buffer module, the buffer module includes a buffer unit on which the substrate is placed, the treating module includes: a cooling chamber for cooling the substrate loaded from the buffer module; a liquid treating chamber for liquid treating the substrate loaded from the cooling chamber; a heat treating chamber for heat treating the substrate loaded from the cooling chamber; and a transfer chamber disposed between the liquid treating chamber and the heat treating chamber, and provided with a transfer robot for transferring the substrate to each of the liquid treating chamber, the heat treating chamber, and the cooling chamber, and when viewed from above, the cooling chamber and the buffer unit are provided in non-overlapping positions.

公开(公告)号：US20230194175A1

公开(公告)日：2023-06-22

申请号：US18083898

申请日：2022-12-19

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Young Jun LEE ,  Ki Sang EUM ,  Tae Hoon LEE

IPC: F27D9/00

CPC classification number: F27D9/00 ,  F27D2009/001 ,  F27D2009/0056 ,  F27D2009/0051 ,  F27D2009/0005 ,  F27D2009/0029

Abstract: Proposed are a chilling unit, a heat treatment apparatus including same, and a heat treatment method. More particularly, proposed is a technology capable of rapidly and effectively lowering the temperature of a heating plate by bringing a heat exchange medium of a chilling unit into contact with the heating plate and then circulating a refrigerant after performing a heat treatment process of a substrate through a heat treatment apparatus.