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    PUMP, CHEMICAL LIQUID SUPPLYING UNIT, AND SUBSTRATE TREATING APPARATUS
    1.
    发明申请
    PUMP, CHEMICAL LIQUID SUPPLYING UNIT, AND SUBSTRATE TREATING APPARATUS 有权

    公开(公告)号：US20230072779A1

    公开(公告)日：2023-03-09

    申请号：US17900761

    申请日：2022-08-31

    Applicant: SEMES CO., LTD.

    Inventor： Young Jun SON ,  Byoung Doo CHOI ,  Sung Chul JUNG ,  Woo Sin JUNG ,  Young Un YUN ,  Woo Ram LEE ,  Ki Sang EUM

    IPC: F04B45/06

    Abstract: Provided is a pump for supplying a liquid. The pump includes: a tube including a pump chamber communicating with a chemical liquid inlet and a chemical liquid outlet, and configured to discharge a chemical liquid through a change in volume due to contraction and expansion; and a driving unit contracting or expanding the tube in a longitudinal direction, in which the tube includes: a flexible tube body including a pump chamber which has an increased internal volume when is contracted in a longitudinal direction and has a decreased internal volume when is expanded in the longitudinal direction, and which has a jar shape of which a radius is increased from the chemical liquid inlet to a center of the pump chamber, and the radius is decreased from the pump chamber to the chemical liquid outlet; a first flange provided at one end of the tube body and including the chemical liquid inlet; and a second flange provided at the other end of the tube body and including the chemical liquid outlet.

    APPARATUS FOR INSPECTING DROPLET AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
    3.
    发明公开
    APPARATUS FOR INSPECTING DROPLET AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME 审中-公开

    公开(公告)号：US20230178389A1

    公开(公告)日：2023-06-08

    申请号：US17989690

    申请日：2022-11-18

    Applicant: SEMES CO., LTD.

    Inventor： Young Jun SON ,  Young Un YUN ,  Sung Chul JUNG

    IPC: H01L21/67 ,  H01L21/66

    CPC classification number: H01L21/67051 ,  H01L22/14

    Abstract: An apparatus for inspecting a chemical solution of the present invention comprises a base unit having an inlet, through which a chemical solution is introduced, a flow path unit, in which the chemical solution introduced through the inlet is moved while a velocity of its fluid is changed, and including a first region unit provided adjacent to the inlet of the base unit and a second region unit being in series communication with the first region unit, in which the chemical solution discharged from the first region unit is moved, a detecting unit including a first detecting member for detecting a first signal that is an electrical signal of the first region unit, and a second detecting member for detecting a second signal that is an electrical signal of the second region unit, and a determining unit for receiving a signal from the detecting unit and determining that a particle and a bubble are detected if a current of the first signal and the second signal is changed compared to a reference value, and discriminating and determining a particle and a bubble according to a difference in a current between the first signal and the second signal or a time difference, in which a current is changed.

    METHOD AND APPARATUS FOR TREATING SUBSTRATE, AND TEMPERATURE CONTROL METHOD
    4.
    发明申请
    METHOD AND APPARATUS FOR TREATING SUBSTRATE, AND TEMPERATURE CONTROL METHOD 有权

    公开(公告)号：US20220390849A1

    公开(公告)日：2022-12-08

    申请号：US17831479

    申请日：2022-06-03

    Applicant: SEMES CO., LTD.

    Inventor： Myung Hwan OH ,  Sung Yong LEE ,  Dong Hyuk SEO ,  Young Un YUN

    IPC: G03F7/40 ,  G03F7/38 ,  G05D23/19

    Abstract: The present invention provides a method of treating a substrate, the method including: performing a first heating process of heat-treating the substrate formed with a film, and a second heating process of heat-treating the substrate after the first heating process is performed; a collection operation of collecting temperature data of a first heating plate which heats the substrate in the first heating process; and a first control operation of adjusting a temperature of a second heating plate which heats the substrate in the second heating process based on the temperature data.

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