公开(公告)号：US11600593B2

公开(公告)日：2023-03-07

申请号：US16658469

申请日：2019-10-21

Applicant: SEMES CO., LTD.

Inventor： Hanglim Lee ,  Jungsuk Goh ,  Kwangsup Kim ,  Doyeon Kim ,  Minyoung Kim ,  Jihoon Park ,  Yungi Kim ,  Do Heon Kim ,  Choonghyun Lee ,  Hyo Seok Lee ,  Soo Ill Jang

IPC: H01L23/00 ,  H01L21/67

Abstract: Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.