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公开(公告)号：US11621159B2
公开(公告)日：2023-04-04
申请号：US16929190
申请日：2020-07-15
Applicant: SEMES CO., LTD.
Inventor： Do Heon Kim , Kihoon Choi , Chan Young Heo , Ki-Moon Kang
Abstract: Disclosed is a method of treating a substrate. In one embodiment, supercritical fluid is supplied to a treatment space in a chamber such that the substrate in the treatment space is treated. The supercritical fluid is supplied to the treatment space while exhausting the treatment space. A temperature of the supercritical fluid supplied when exhausting the treatment space is higher than a temperature of the supercritical fluid supplied to the treatment space for treating the substrate.
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公开(公告)号：US10831103B2
公开(公告)日：2020-11-10
申请号：US16565661
申请日：2019-09-10
Applicant: SEMES CO., LTD.
Inventor： Kihoon Choi , Chan Young Heo , Do Heon Kim , Hae-Won Choi , Jaeseong Lee , Anton Koriakin , Ji Soo Jeong
Abstract: An apparatus for treating a substrate includes a developing chamber that performs a developing process on the substrate by supplying a developing solution, a supercritical chamber that treats the substrate by supplying a supercritical fluid, and a transfer chamber having a transfer unit that transfers the substrate W between the developing chamber and the supercritical chamber.
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公开(公告)号：US11887866B2
公开(公告)日：2024-01-30
申请号：US16657983
申请日：2019-10-18
Applicant: SEMES CO., LTD.
Inventor： Jae Seong Lee , Hae Won Choi , Ki Hoon Choi , Anton Koriakin , Chan Young Heo , Do Heon Kim , Ji Soo Jeon
CPC classification number: H01L21/67028 , B08B3/04 , H01L21/67126
Abstract: A supercritical processing apparatus includes an upper vessel including a first fluid hole formed in a center thereof, and a lower vessel including a second fluid hole formed in a center thereof. A space is defined between the upper and lower vessels and configured to allow a substrate to be placed therein. The upper vessel further includes a first guide portion provided at a lower portion thereof to be gradually inclined downward toward a periphery thereof from the first fluid hole.
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Patent Agency Ranking
4.发明授权公开(公告)号：US11530375B2
公开(公告)日：2022-12-20
申请号：US16600166
申请日：2019-10-11
Applicant: SEMES CO., LTD.
Inventor： Hae-Won Choi , Kihoon Choi , Jaeseong Lee , Chan Young Heo , Anton Koriakin , Do Heon Kim , Ji Soo Jeong
IPC: B08B3/04 , C11D7/50 , B08B3/08 , C11D11/00 , H01L21/02 , C11D7/08 , C11D7/36 , H01L21/67 , C11D7/26
Abstract: A composition for cleaning a substrate is provided. According to an embodiment, the composition for cleaning the substrate includes an organic solvent having a Hansen solubility parameter of 5 or more to 12 or less for polystyrene latex to the substrate.
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公开(公告)号：US11410862B2
公开(公告)日：2022-08-09
申请号：US16396736
申请日：2019-04-28
Applicant: SEMES CO., LTD.
Inventor： Jaeseong Lee , Kihoon Choi , Hae-Won Choi , Anton Koriakin , Chan Young Heo , Do Heon Kim , Ji Soo Jeong
Abstract: An apparatus for processing a substrate includes a chamber having a processing space inside, a substrate support unit that supports the substrate in the processing space, and a temperature adjustment unit that is installed in the chamber and that adjusts temperature in the processing space. The temperature adjustment unit includes a heating member that heats the processing space and a cooling member that cools the processing space. The cooling member is located closer to a central axis of the chamber than the heating member.
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公开(公告)号：US11890639B2
公开(公告)日：2024-02-06
申请号：US16936132
申请日：2020-07-22
Applicant: SEMES CO., LTD.
Inventor： Chan Young Heo , Kihoon Choi , Ki-Moon Kang , Do Heon Kim , Jaeseong Lee
CPC classification number: B05C5/0208 , B05C5/0225 , B05C11/1002 , B05C11/1042
Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a fluid supply unit for supplying supercritical fluid to the treatment space, and a controller configured to control the fluid supply unit, wherein the fluid supply unit is configured to selectively supply the supercritical fluid at a first density or a second density higher than the first density into the treatment space. Thus, drying efficiency of the substrate when drying the substrate using the supercritical fluid may be improved.
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公开(公告)号：US11600593B2
公开(公告)日：2023-03-07
申请号：US16658469
申请日：2019-10-21
Applicant: SEMES CO., LTD.
Inventor： Hanglim Lee , Jungsuk Goh , Kwangsup Kim , Doyeon Kim , Minyoung Kim , Jihoon Park , Yungi Kim , Do Heon Kim , Choonghyun Lee , Hyo Seok Lee , Soo Ill Jang
Abstract: Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.
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公开(公告)号：US10908503B2
公开(公告)日：2021-02-02
申请号：US16565661
申请日：2019-09-10
Applicant: SEMES CO., LTD.
Inventor： Kihoon Choi , Chan Young Heo , Do Heon Kim , Hae-Won Choi , Jaeseong Lee , Anton Koriakin , Ji Soo Jeong
Abstract: An apparatus for treating a substrate includes a developing chamber that performs a developing process on the substrate by supplying a developing solution, a supercritical chamber that treats the substrate by supplying a supercritical fluid, and a transfer chamber having a transfer unit that transfers the substrate W between the developing chamber and the supercritical chamber.
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