公开(公告)号：US12046466B2

公开(公告)日：2024-07-23

申请号：US17965911

申请日：2022-10-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun Seo ,  Hyun Yoon ,  Jungsuk Goh ,  Byeong Geun Kim ,  Yoonki Sa ,  Doyeon Kim ,  Yerim Yeon ,  Choonghyun Lee ,  Pil Kyun Heo ,  Youngje Um ,  Jaeseong Lee ,  Dongok Ahn

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02101 ,  H01L21/6715

Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

公开(公告)号：US11961695B2

公开(公告)日：2024-04-16

申请号：US17409840

申请日：2021-08-24

Applicant: SEMES CO., LTD.

Inventor： Doyeon Kim ,  Hyun Yoon ,  Ho Jong Hwang

IPC: H01J37/02 ,  H01J37/20 ,  H01J37/317 ,  H01L21/687

CPC classification number: H01J37/026 ,  H01J37/20 ,  H01J37/3171 ,  H01L21/6875 ,  H01J2237/0044 ,  H01J2237/2007

Abstract: An apparatus for treating a substrate includes a process chamber that performs a liquid treatment process by dispensing a treatment liquid onto the substrate, and components provided in the process chamber. A surface of at least one of the components is formed of a material containing an ion-implanted fluorine resin.

公开(公告)号：US11600593B2

公开(公告)日：2023-03-07

申请号：US16658469

申请日：2019-10-21

Applicant: SEMES CO., LTD.

Inventor： Hanglim Lee ,  Jungsuk Goh ,  Kwangsup Kim ,  Doyeon Kim ,  Minyoung Kim ,  Jihoon Park ,  Yungi Kim ,  Do Heon Kim ,  Choonghyun Lee ,  Hyo Seok Lee ,  Soo Ill Jang

IPC: H01L23/00 ,  H01L21/67

Abstract: Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.

公开(公告)号：US11167326B2

公开(公告)日：2021-11-09

申请号：US16502272

申请日：2019-07-03

Applicant: SEMES CO., LTD.

Inventor： Min Sung Han ,  Doyeon Kim ,  Jinkyu Kim ,  Yoon Jong Ju

IPC: H01L21/67 ,  B08B7/00

Abstract: An apparatus for processing a substrate comprises a processing vessel having a processing space inside, a substrate support unit that supports and rotates the substrate in the processing vessel, and a nozzle unit that dispenses a processing liquid onto the substrate. The nozzle unit comprises a nozzle that dispenses the processing liquid and an ultraviolet (UV) light supply unit that emits UV light to activate radicals of the processing liquid dispensed onto the substrate.