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公开(公告)号：US11850635B2
公开(公告)日：2023-12-26
申请号：US17402882
申请日：2021-08-16
Applicant: SEMES Co., Ltd.
Inventor： Dong Hee Son , Ki Young Kwak
Abstract: A substrate processing apparatus includes a support unit; a first nozzle for discharging a first rinse solution to a first area of the substrate; and a second nozzle for discharging a second rinse solution to a second area of the substrate, wherein the first nozzle discharges the first rinse solution to a first area during a first period so that the first area and the second area of the substrate are wetted by the first rinse solution, and some area of the substrate is not wetted by the first rinse solution, wherein the first nozzle discharges the first rinse solution to the first area and the second nozzle discharges the second rinse solution to the second area in a second period directly connected to the first period so that an entire upper surface of the substrate is wetted by the first rinse solution and the second rinse solution.
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Patent Agency Ranking
公开(公告)号：US11897006B2
公开(公告)日：2024-02-13
申请号：US17740358
申请日：2022-05-10
Applicant: SEMES CO., LTD.
Inventor： Ki Young Kwak , Sang Young Kwon , Cha Sub Shim
CPC classification number: B08B3/022 , B08B3/08 , B08B3/14 , B08B2203/0264
Abstract: The present disclosure provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a substrate support unit configured to support a substrate, a liquid supply unit configured to supply a liquid containing any one of a chemical liquid and a cleaning liquid to the substrate supported by the substrate support unit, a processing container configured to accommodate the substrate support unit and recover the liquid supplied to the substrate from the liquid supply unit, and a capture module provided in the processing container to capture the liquid so as to suppress the liquid scattered from the substrate from being bounced back from the processing container and re-scattering.
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公开(公告)号：US20220203415A1
公开(公告)日：2022-06-30
申请号：US17404242
申请日：2021-08-17
Applicant: SEMES Co., Ltd.
Inventor： Ki Young Kwak , Hyun Ho Lee
Abstract: A substrate processing apparatus includes a process module including a substrate support unit, an inverting unit and a processing unit, and a transfer module, wherein the inverting unit inverts a substrate so that a second surface faces upward, and provides the inverted substrate to the substrate support unit, wherein the processing unit performs a first processing on the second surface of the substrate seated on the substrate support unit, wherein the inverting unit inverts the first processed substrate so that the first surface faces upward, wherein the transfer module takes the substrate with a first surface facing upward out of the process module, and introduces again the substrate with a first surface facing upward into the process module to seat it on the substrate support unit, wherein the processing unit performs a second processing on the first surface of the substrate seated on the substrate support unit.
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公开(公告)号：US20220355344A1
公开(公告)日：2022-11-10
申请号：US17732691
申请日：2022-04-29
Applicant: SEMES CO., LTD.
Inventor： Hyun Seok Choi , Ki Young Kwak , Dong Hee Son , Jong Hwan Park , Jong Jin Jung
Abstract: An apparatus and method for treating a substrate that implement a recipe capable of increasing an absorption amount of metal ions to the substrate are provided. The method for treating the substrate includes: ejecting a substrate treating liquid onto the substrate; rotating the substrate at a first low-speed; and when the ejecting of the substrate treating liquid has been finished, drying the substrate.
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公开(公告)号：US20220126330A1
公开(公告)日：2022-04-28
申请号：US17402882
申请日：2021-08-16
Applicant: SEMES Co., Ltd.
Inventor： Dong Hee Son , Ki Young Kwak
Abstract: A substrate processing apparatus includes a support unit; a first nozzle for discharging a first rinse solution to a first area of the substrate; and a second nozzle for discharging a second rinse solution to a second area of the substrate, wherein the first nozzle discharges the first rinse solution to a first area during a first period so that the first area and the second area of the substrate are wetted by the first rinse solution, and some area of the substrate is not wetted by the first rinse solution, wherein the first nozzle discharges the first rinse solution to the first area and the second nozzle discharges the second rinse solution to the second area in a second period directly connected to the first period so that an entire upper surface of the substrate is wetted by the first rinse solution and the second rinse solution.
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公开(公告)号：US11571724B2
公开(公告)日：2023-02-07
申请号：US17404242
申请日：2021-08-17
Applicant: SEMES Co., Ltd.
Inventor： Ki Young Kwak , Hyun Ho Lee
Abstract: A substrate processing apparatus includes a process module including a substrate support unit, an inverting unit and a processing unit, and a transfer module, wherein the inverting unit inverts a substrate so that a second surface faces upward, and provides the inverted substrate to the substrate support unit, wherein the processing unit performs a first processing on the second surface of the substrate seated on the substrate support unit, wherein the inverting unit inverts the first processed substrate so that the first surface faces upward, wherein the transfer module takes the substrate with a first surface facing upward out of the process module, and introduces again the substrate with a first surface facing upward into the process module to seat it on the substrate support unit, wherein the processing unit performs a second processing on the first surface of the substrate seated on the substrate support unit.
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