公开(公告)号：US20240274506A1

公开(公告)日：2024-08-15

申请号：US18167929

申请日：2023-02-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Changsun YUN ,  Oseob JEON

IPC: H01L23/473

CPC classification number: H01L23/4735

Abstract: A jet impingement cooling assembly for semiconductor devices may include a heat exchange base having an inlet chamber and an outlet chamber, an inlet connection in fluid connection with the inlet chamber, and an outlet connection in fluid connection with the outlet chamber. A plurality of jet nozzles may be attached to a semiconductor module, with the plurality of jet nozzles including corresponding openings positioned to cause jet impingement of fluid flow from the inlet chamber onto the semiconductor module and then into the outlet chamber.

公开(公告)号：US20230327350A1

公开(公告)日：2023-10-12

申请号：US18190725

申请日：2023-03-27

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Dongwook KANG ,  Youngsun KO ,  Jeungdae KIM ,  Changsun YUN ,  Jihwan KIM

IPC: H01R12/58 ,  H01R43/16 ,  H01R43/26

CPC classification number: H01R12/585 ,  H01R43/26 ,  H01R43/16

Abstract: In a general aspect, an electronic device assembly includes a substrate arranged in a plane. The substrate has a first side and a second side, the second side being opposite the first side. The assembly also includes a plurality of semiconductor die disposed on the first side of the substrate and at least one signal pin. The at least one signal pin includes a proximal end portion coupled with the first side of the substrate, a distal end portion, and a medial portion disposed between the proximal end portion and the distal end portion. The medial portion is pre-molded in a molding compound, the proximal end portion and the distal end portion exclude the molding compound. The at least one signal pin is arranged along a longitudinal axis that is orthogonal to the plane of the substrate.