公开(公告)号：US20220199602A1

公开(公告)日：2022-06-23

申请号：US17247797

申请日：2020-12-23

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jonghwan BAEK ,  JeongHyuk PARK ,  Seungwon IM ,  Keunhyuk LEE

IPC: H01L25/18 ,  H01L23/495 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00

Abstract: Described implementations provide wireless, surface mounting of at least two semiconductor die on die attach pads (DAPs) of the semiconductor package, where the at least two semiconductor die are electrically connected by a clip. A stress buffer layer may be provided on the clip, and a heatsink may be provided on the stress buffer layer. The heatsink may be secured with an external mold material.

公开(公告)号：US20230245953A1

公开(公告)日：2023-08-03

申请号：US18295942

申请日：2023-04-05

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jonghwan BAEK ,  JeongHyuk PARK ,  Seungwon IM ,  Keunhyuk LEE

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/32 ,  H01L2924/1531 ,  H01L2224/48247 ,  H01L2224/32014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/48091

Abstract: Implementations of semiconductor packages may include a substrate, a first die coupled on the substrate, and a lead frame coupled over the substrate. The lead frame may include a die attach pad. Implementations of semiconductor packages may also include a second die coupled on the die attach pad. The second die may overlap the first die.

公开(公告)号：US20220208654A1

公开(公告)日：2022-06-30

申请号：US17136340

申请日：2020-12-29

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jonghwan BAEK ,  JeongHyuk PARK ,  Seungwon IM ,  Keunhyuk LEE

IPC: H01L23/495 ,  H01L23/00

Abstract: Implementations of semiconductor packages may include a substrate, a first die coupled on the substrate, and a lead frame coupled over the substrate. The lead frame may include a die attach pad. Implementations of semiconductor packages may also include a second die coupled on the die attach pad. The second die may overlap the first die.

公开(公告)号：US20250125227A1

公开(公告)日：2025-04-17

申请号：US18990219

申请日：2024-12-20

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jonghwan BAEK ,  JeongHyuk PARK ,  Seungwon IM ,  Keunhyuk LEE

IPC: H01L23/495 ,  H01L23/00

Abstract: Implementations of semiconductor packages may include a substrate, a first die coupled on the substrate, and a lead frame coupled over the substrate. The lead frame may include a die attach pad. Implementations of semiconductor packages may also include a second die coupled on the die attach pad. The second die may overlap the first die.

公开(公告)号：US20230253393A1

公开(公告)日：2023-08-10

申请号：US18301939

申请日：2023-04-17

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jonghwan BAEK ,  JeongHyuk PARK ,  Seungwon IM ,  Keunhyuk LEE

IPC: H01L25/18 ,  H01L23/495 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/18 ,  H01L23/49524 ,  H01L23/3677 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/33 ,  H01L25/50 ,  H01L23/49575 ,  H01L2224/33181 ,  H01L2224/32245

Abstract: Described implementations provide wireless, surface mounting of at least two semiconductor die on die attach pads (DAPs) of the semiconductor package, where the at least two semiconductor die are electrically connected by a clip. A stress buffer layer may be provided on the clip, and a heatsink may be provided on the stress buffer layer. The heatsink may be secured with an external mold material.