公开(公告)号：US11075148B2

公开(公告)日：2021-07-27

申请号：US16675525

申请日：2019-11-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jeffrey Peter Gambino ,  David T. Price ,  Jeffery A. Neuls ,  Dean E. Probst ,  Santosh Menon ,  Peter A. Burke ,  Bigildis Dosdos

IPC: H01L23/00 ,  H01L23/495 ,  H01L25/00 ,  H01L25/11

Abstract: A stacked assembly of semiconductor devices includes a mounting pad covering a first portion of a low-side semiconductor device, and a contact layer covering a second portion of the low-side semiconductor device. A first mounting clip electrically connected to the contact layer has a supporting portion joining the first mounting clip to a first lead frame portion. A second mounting clip attached to the mounting pad has a supporting portion joining the second mounting clip to a second lead frame portion. A high-side semiconductor device has a first terminal electrically connected to the first mounting clip and thereby to the contact layer, and a second terminal electrically connected to the second mounting clip.