公开(公告)号：US20240096734A1

公开(公告)日：2024-03-21

申请号：US18520361

申请日：2023-11-27

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Tzu-Hsuan CHENG ,  Yong LIU ,  Liangbiao CHEN

IPC: H01L23/367 ,  H01L21/52 ,  H01L21/56 ,  H01L23/00 ,  H01L23/373 ,  H01L23/495 ,  H05K7/20

CPC classification number: H01L23/3675 ,  H01L21/52 ,  H01L21/565 ,  H01L23/3735 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/33 ,  H05K7/2089 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/84801 ,  H01L2924/13055

Abstract: A semiconductor device module may include a leadframe spacer that provides the functions of both a leadframe and a spacer, while enabling a double-sided cooling configuration. Such a leadframe spacer may include a leadframe surface that provides a die attach pad (DAP) that is shared by at least two semiconductor devices. The leadframe spacer may include at least one downset, where the semiconductor devices may be attached within a recess defined by the at least one downset. A first substrate may be connected to a first side of the leadframe. A second substrate may be connected to downset surfaces of the at least one downset, and positioned for further connection to the semiconductor devices in a double-sided assembly.

公开(公告)号：US20210398874A1

公开(公告)日：2021-12-23

申请号：US17447011

申请日：2021-09-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Tzu-Hsuan CHENG ,  Yong LIU ,  Liangbiao CHEN

IPC: H01L23/367 ,  H01L21/52 ,  H01L21/56 ,  H01L23/373 ,  H01L23/495 ,  H05K7/20 ,  H01L23/00

Abstract: A semiconductor device module may include a leadframe spacer that provides the functions of both a leadframe and a spacer, while enabling a double-sided cooling configuration. Such a leadframe spacer may include a leadframe surface that provides a die attach pad (DAP) that is shared by at least two semiconductor devices. The leadframe spacer may include at least one downset, where the semiconductor devices may be attached within a recess defined by the at least one downset. A first substrate may be connected to a first side of the leadframe. A second substrate may be connected to downset surfaces of the at least one downset, and positioned for further connection to the semiconductor devices in a double-sided assembly.

公开(公告)号：US20240136247A1

公开(公告)日：2024-04-25

申请号：US18535726

申请日：2023-12-11

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Liangbiao CHEN ,  Yong LIU ,  Tzu-Hsuan CHENG ,  Stephen ST. GERMAIN ,  Roger ARBUTHNOT

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H05K7/20

CPC classification number: H01L23/3675 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3735 ,  H01L24/32 ,  H05K7/2089 ,  H01L2224/32245 ,  H01L2224/84801 ,  H01L2924/13055

Abstract: In at least one aspect, a method can include shaping a block of flexible spacer material. The method can include shaping a portion of the block of flexible spacer material to receive a solid metal block. The method can include coupling the solid metal block to the portion of the block of flexible spacer material.

公开(公告)号：US20210217679A1

公开(公告)日：2021-07-15

申请号：US16740130

申请日：2020-01-10

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Tzu-Hsuan CHENG ,  Yong LIU ,  Liangbiao CHEN

IPC: H01L23/367 ,  H01L21/52 ,  H01L21/56 ,  H01L23/373 ,  H01L23/495 ,  H01L23/00 ,  H05K7/20

Abstract: A semiconductor device module may include a leadframe spacer that provides the functions of both a leadframe and a spacer, while enabling a double-sided cooling configuration. Such a leadframe spacer may include a leadframe surface that provides a die attach pad (DAP) that is shared by at least two semiconductor devices. The leadframe spacer may include at least one downset, where the semiconductor devices may be attached within a recess defined by the at least one downset. A first substrate may be connected to a first side of the leadframe. A second substrate may be connected to downset surfaces of the at least one downset, and positioned for further connection to the semiconductor devices in a double-sided assembly.

公开(公告)号：US20220208637A1

公开(公告)日：2022-06-30

申请号：US17655398

申请日：2022-03-18

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Liangbiao CHEN ,  Yong LIU ,  Tzu-Hsuan CHENG ,  Stephen ST. GERMAIN ,  Roger ARBUTHNOT

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/373 ,  H01L23/31 ,  H01L23/00 ,  H05K7/20

Abstract: A power module includes a spacer block, a thermally conductive substrate coupled to one side of the spacer block, and a semiconductor device die coupled to an opposite side of the spacer block. The spacer block includes a solid spacer block and an adjacent flexible spacer block. An inner portion of the device die is coupled to the solid spacer block, and an outer portion of the semiconductor device die is coupled to the adjacent flexible spacer block.
Claims 3 and 10 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.

公开(公告)号：US20210249329A1

公开(公告)日：2021-08-12

申请号：US16784999

申请日：2020-02-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Liangbiao CHEN ,  Yong LIU ,  Tzu-Hsuan CHENG ,  Stephen ST. GERMAIN ,  Roger ARBUTHNOT

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/373 ,  H01L23/31 ,  H05K7/20 ,  H01L23/00

Abstract: A power module includes a spacer block, a thermally conductive substrate coupled to one side of the spacer block, and a semiconductor device die coupled to an opposite side of the spacer block. The spacer block includes a solid spacer block and an adjacent flexible spacer block. An inner portion of the device die is coupled to the solid spacer block, and an outer portion of the semiconductor device die is coupled to the adjacent flexible spacer block.