Manufacturing method of semiconductor device comprising oxide semiconductor layer
    1.
    发明授权
    Manufacturing method of semiconductor device comprising oxide semiconductor layer 有权
    包括氧化物半导体层的半导体器件的制造方法

    公开(公告)号:US09252248B2

    公开(公告)日:2016-02-02

    申请号:US14682376

    申请日:2015-04-09

    Abstract: An object is to provide a technique by which a semiconductor device including a high-performance and high-reliable transistor is manufactured. A protective conductive film which protects an oxide semiconductor layer when a wiring layer is formed from a conductive layer is formed between the oxide semiconductor layer and the conductive layer, and an etching process having two steps is performed. In a first etching step, an etching is performed under conditions that the protective conductive film is less etched than the conductive layer and the etching selectivity of the conductive layer to the protective conductive film is high. In a second etching step, etching is performed under conditions that the protective conductive film is more easily etched than the oxide semiconductor layer and the etching selectivity of the protective conductive film to the oxide semiconductor layer is high.

    Abstract translation: 本发明的目的是提供一种制造包括高性能和高可靠性晶体管的半导体器件的技术。 在氧化物半导体层和导电层之间形成由导电层形成布线层时保护氧化物半导体层的保护导电膜,并且进行具有两个步骤的蚀刻工艺。 在第一蚀刻步骤中,在保护导电膜比导电层蚀刻少的条件下进行蚀刻,并且导电层对保护导电膜的蚀刻选择性高。 在第二蚀刻步骤中,在保护导电膜比氧化物半导体层更容易蚀刻的条件下进行蚀刻,并且保护性导电膜对氧化物半导体层的蚀刻选择性高。

    Manufacturing method of semiconductor device
    3.
    发明授权
    Manufacturing method of semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号:US09040396B2

    公开(公告)日:2015-05-26

    申请号:US14169837

    申请日:2014-01-31

    Abstract: An object is to provide a technique by which a semiconductor device including a high-performance and high-reliable transistor is manufactured. A protective conductive film which protects an oxide semiconductor layer when a wiring layer is formed from a conductive layer is formed between the oxide semiconductor layer and the conductive layer, and an etching process having two steps is performed. In a first etching step, an etching is performed under conditions that the protective conductive film is less etched than the conductive layer and the etching selectivity of the conductive layer to the protective conductive film is high. In a second etching step, etching is performed under conditions that the protective conductive film is more easily etched than the oxide semiconductor layer and the etching selectivity of the protective conductive film to the oxide semiconductor layer is high.

    Abstract translation: 本发明的目的是提供一种制造包括高性能和高可靠性晶体管的半导体器件的技术。 在氧化物半导体层和导电层之间形成由导电层形成布线层时保护氧化物半导体层的保护导电膜,并且进行具有两个步骤的蚀刻工艺。 在第一蚀刻步骤中,在保护导电膜比导电层蚀刻少的条件下进行蚀刻,并且导电层对保护导电膜的蚀刻选择性高。 在第二蚀刻步骤中,在保护导电膜比氧化物半导体层更容易蚀刻的条件下进行蚀刻,并且保护性导电膜对氧化物半导体层的蚀刻选择性高。

    LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    液晶显示装置及其制造方法

    公开(公告)号:US20140024154A1

    公开(公告)日:2014-01-23

    申请号:US14038899

    申请日:2013-09-27

    CPC classification number: H01L27/1262 G02F1/133553 G02F1/13725

    Abstract: In the liquid crystal display device in which a guest-host liquid crystal layer is provided between a first substrate having a reflective film which is a pixel electrode layer (also referred to as a first electrode layer) and a second substrate having a common electrode layer (also referred to as a second electrode layer), the reflective film which is a pixel electrode layer is projected into the liquid crystal layer, and a micron-sized first unevenness and a nano-sized second unevenness on the first unevenness are provided.

    Abstract translation: 在具有作为像素电极层(也称为第一电极层)的反射膜的第一基板和具有公共电极层的第二基板之间设置客体主体液晶层的液晶显示装置 (也称为第二电极层),作为像素电极层的反射膜投射到液晶层中,并且在第一凹凸上设置微米级的第一凹凸和纳米尺寸的第二凹凸。

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