公开(公告)号：US20220153989A1

公开(公告)日：2022-05-19

申请号：US17437555

申请日：2019-04-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Liexiang HE ,  Yongnian QI ,  Xianping ZENG ,  Zhongqiang YANG ,  Hualin PAN

IPC: C08L63/04 ,  C08J5/24 ,  C08K3/013 ,  C08K5/00

Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.

公开(公告)号：US20220135788A1

公开(公告)日：2022-05-05

申请号：US17437564

申请日：2019-04-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Liexiang HE ,  Yaode ZENG ,  Zhongqiang YANG ,  Yu YANG ,  Hualin PAN ,  Yongjing XU

IPC: C08L63/04 ,  C08K5/3432 ,  C08K5/098 ,  C08K3/36 ,  C08J5/24 ,  H05K1/03

Abstract: The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.