公开(公告)号：US20200207976A1

公开(公告)日：2020-07-02

申请号：US16063079

申请日：2016-09-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xianping ZENG ,  Liexiang HE ,  Haosheng XU

IPC: C08L63/00 ,  C08G59/32 ,  C08G59/42 ,  C08J5/24 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03

Abstract: Provided are an epoxy resin composition and a prepreg, laminated board and printed-circuit board comprising same. The epoxy resin composition comprises the following components: (A) 38-54 parts by weight of an epoxy resin comprising a DCPD structure; (B) 30-36 parts by weight of an active ester curing agent; and (C) 16-32 parts by weight of a cyanate resin, With the mutual cooperation and synergistic facilitation effects of the particular contents of the three essential components, the epoxy resin composition is obtained. Under the premise of having a high resistance to heat and humidity and a high heat resistance at the same time, the prepreg, laminated board and printed-circuit board made of the epoxy resin composition further have a low thermal expansion coefficient, a low water absorption rate and excellent dielectric properties.

公开(公告)号：US20220153989A1

公开(公告)日：2022-05-19

申请号：US17437555

申请日：2019-04-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Liexiang HE ,  Yongnian QI ,  Xianping ZENG ,  Zhongqiang YANG ,  Hualin PAN

IPC: C08L63/04 ,  C08J5/24 ,  C08K3/013 ,  C08K5/00

Abstract: The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.

公开(公告)号：US20220135788A1

公开(公告)日：2022-05-05

申请号：US17437564

申请日：2019-04-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Liexiang HE ,  Yaode ZENG ,  Zhongqiang YANG ,  Yu YANG ,  Hualin PAN ,  Yongjing XU

IPC: C08L63/04 ,  C08K5/3432 ,  C08K5/098 ,  C08K3/36 ,  C08J5/24 ,  H05K1/03

Abstract: The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.

公开(公告)号：US20200087507A1

公开(公告)日：2020-03-19

申请号：US15744686

申请日：2017-08-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xianping ZENG ,  Liexiang HE

IPC: C08L63/04 ,  C09K21/12 ,  C08J5/24 ,  B32B5/26 ,  B32B17/04 ,  B32B15/092 ,  H05K1/03

Abstract: The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.