公开(公告)号：US20180220530A1

公开(公告)日：2018-08-02

申请号：US15744244

申请日：2016-03-02

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing CHEN ,  Xianping ZENG ,  Chiji GUAN ,  Yongjing XU

IPC: H05K1/03 ,  C08L71/12 ,  C08L83/04 ,  C08K5/00 ,  C08K5/5313

Abstract: The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has the advantages of a low dielectric constant, a low dielectric loss, high heat resistance, low water absorption, a high interlayer adhesive force and a high bending strength, and is very suitable as a circuit substrate of high-speed electronic equipment.

公开(公告)号：US20200247970A1

公开(公告)日：2020-08-06

申请号：US16523753

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin CHEN ,  Qianfa LIU ,  Shanyin YAN ,  Xianping ZENG ,  Cuiming DU

IPC: C08J5/24 ,  C08L71/12 ,  C08L25/10 ,  C08L47/00 ,  H05K1/03 ,  B32B15/14

Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.

公开(公告)号：US20200247947A1

公开(公告)日：2020-08-06

申请号：US16523735

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin CHEN ,  Qianfa LIU ,  Shanyin YAN ,  Xianping ZENG ,  Cuiming DU

IPC: C08G65/329 ,  C08K5/14 ,  C08J5/24 ,  C08K9/04 ,  C08K7/26 ,  C08K3/38 ,  C08F236/06 ,  C08L53/02

Abstract: A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.

公开(公告)号：US20160244610A1

公开(公告)日：2016-08-25

申请号：US15027365

申请日：2014-08-11

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing CHEN ,  Xianping ZENG

IPC: C08L71/12 ,  C09D171/12 ,  H05K1/03 ,  C08J5/24

CPC classification number: C08L71/126 ,  B32B15/08 ,  B32B27/04 ,  C08J5/24 ,  C08J2371/12 ,  C08J2483/04 ,  C08L71/12 ,  C09D171/12 ,  H05K1/03 ,  H05K1/038

Abstract: The present invention discloses a resin composition, comprising an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit). The present invention further discloses a high-frequency circuit substrate prepared from the aforesaid resin composition and the uses of the aforesaid resin composition in the art. The high frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interstratified adhesive force, a low dielectric constant and a low dielectric loss tangent, and are very suitable as the circuit substrates of high frequency electronic equipments.

Abstract translation: 本发明公开了一种树脂组合物，其包含不饱和热固性改性聚苯醚树脂和含有不饱和双键并具有三维网状结构并由单官能硅氧烷单元（M单元）和四官能二氧化硅单元（Q单元）水解缩合的MQ有机硅树脂 ）。 本发明还公开了由上述树脂组合物制备的高频电路基片和本领域中上述树脂组合物的用途。 本发明的高频电路基板具有高玻璃化转变温度，高热分解温度，高分层粘合力，低介电常数和低介电损耗角正切，并且非常适合作为高频电路基板 电子设备。

公开(公告)号：US20150189744A1

公开(公告)日：2015-07-02

申请号：US14580321

申请日：2014-12-23

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xianping ZENG ,  Nana REN

IPC: H05K1/03 ,  C08L85/02 ,  H01B1/02 ,  C08L63/00

CPC classification number: H01B1/026 ,  C08L63/00 ,  C08L85/02 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L71/126

Abstract: The present invention relates to a thermosetting resin composition, wherein the resin composition comprises of: (A) epoxy resin; (B) active ester curing agent; (C) poly-phosphonate ester and/or phosphonate-carbonate copolymer. The prepreg and copper clad laminate prepared with the thermosetting resin composition mentioned above has excellent dielectric performance, wet-heat resistance performance, and a flame resistance performance of UL 94 V-0 level.

Abstract translation: 本发明涉及热固性树脂组合物，其中树脂组合物包含：（A）环氧树脂; （B）活性酯固化剂; （C）聚膦酸酯和/或膦酸酯 - 碳酸酯共聚物。 使用上述热固性树脂组合物制备的预浸料和覆铜层压板具有优异的介电性能，耐湿热性能和UL 94 V-0级别的阻燃性能。

公开(公告)号：US20200207976A1

公开(公告)日：2020-07-02

申请号：US16063079

申请日：2016-09-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xianping ZENG ,  Liexiang HE ,  Haosheng XU

IPC: C08L63/00 ,  C08G59/32 ,  C08G59/42 ,  C08J5/24 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03

Abstract: Provided are an epoxy resin composition and a prepreg, laminated board and printed-circuit board comprising same. The epoxy resin composition comprises the following components: (A) 38-54 parts by weight of an epoxy resin comprising a DCPD structure; (B) 30-36 parts by weight of an active ester curing agent; and (C) 16-32 parts by weight of a cyanate resin, With the mutual cooperation and synergistic facilitation effects of the particular contents of the three essential components, the epoxy resin composition is obtained. Under the premise of having a high resistance to heat and humidity and a high heat resistance at the same time, the prepreg, laminated board and printed-circuit board made of the epoxy resin composition further have a low thermal expansion coefficient, a low water absorption rate and excellent dielectric properties.

公开(公告)号：US20200157261A1

公开(公告)日：2020-05-21

申请号：US16631929

申请日：2017-10-19

Applicant: Shengyi Technology Co., Ltd.

Inventor： Chiji GUAN ,  Xianping ZENG ,  Guangbing CHEN ,  Haosheng XU

IPC: C08F212/36 ,  C08J5/24 ,  C08L23/20 ,  C08L9/00 ,  C08F236/06 ,  C08F212/06 ,  B32B15/082 ,  B32B15/14

Abstract: Thermosetting resin composition, prepreg, and metal foil clad laminate prepared from same. The thermosetting resin composition comprises (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a polyfunctional vinyl aromatic copolymer having a structural unit derived from a monomer including a divinyl aromatic compound and an ethyl vinyl aromatic compound, and (B): selected from a polybutadiene resin having a number-average molecular weight of 500 to 10,000; the content of vinyl addition across 1, 2 positions in the molecule of the polybutadiene resin being 50% or more. The prepreg and the copper foil clad laminate prepared from the thermosetting resin composition of the present invention have a good toughness, maintain a high glass-transition temperature and a low water absorption, dielectric property and heat and humidity resistance, and are suitable for use in the field of high-frequency high-speed printed circuit boards and for processing of multilayer printed circuit boards.

公开(公告)号：US20180037705A1

公开(公告)日：2018-02-08

申请号：US15555826

申请日：2015-09-18

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xianping ZENG ,  Guangbing CHEN ,  Chiji GUAN ,  Wenhua YANG

IPC: C08J5/24 ,  H05K1/03 ,  B32B37/10 ,  C08L71/12 ,  B32B15/20 ,  B32B15/085

Abstract: Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem.

公开(公告)号：US20150183992A1

公开(公告)日：2015-07-02

申请号：US14580298

申请日：2014-12-23

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xianping ZENG ,  Yujun XIN

IPC: C08L79/00 ,  H05K1/03 ,  C08J5/24 ,  B32B27/28 ,  B32B15/20 ,  B32B27/06 ,  B32B27/38 ,  C08L63/00 ,  B32B15/092

CPC classification number: B32B15/20 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/02 ,  C08J2379/00 ,  C08J2463/04 ,  C08J2485/02 ,  C08L63/00 ,  C08L2205/03 ,  H05K1/0326 ,  H05K1/0366 ,  Y10T428/31522 ,  C08L79/04 ,  C08L85/02

Abstract: The present invention relates to a thermosetting resin composition, wherein the resin composition comprises: (A) an epoxy resin with main chain containing naphthol structure; (B) a cyanate ester compound or/and an isocyanate ester prepolymer; (C) a poly phosphonate ester or/and phosphonate-carbonate copolymer. The thermosetting resin provided by the present invention has low dielectric constant and dielectric loss angular tangent value. The prepreg and copper-clad laminate made from the thermosetting resin composition above has excellent dielectrical properties, wet-heat resistance, flame resistance of UL94 V-0 grade and good technical processing performance.

Abstract translation: 本发明涉及一种热固性树脂组合物，其中树脂组合物包含：（A）具有含有萘酚结构的主链的环氧树脂; （B）氰酸酯化合物或/和异氰酸酯预聚物; （C）聚膦酸酯或/和膦酸酯 - 碳酸酯共聚物。 由本发明提供的热固性树脂具有低介电常数和介电损耗角正切值。 由上述热固性树脂组合物制成的预浸料和覆铜层压板具有优异的介电性能，耐湿热性，UL94 V-0等级的阻燃性和良好的技术加工性能。

公开(公告)号：US20220210914A1

公开(公告)日：2022-06-30

申请号：US17605820

申请日：2020-01-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing CHEN ,  Xianping ZENG ,  Yongjing XU ,  Yongming ZHU

IPC: H05K1/03 ,  H05K1/09 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  C08L9/00 ,  C08L9/06 ,  C08L51/08

Abstract: A copper clad laminate and a printed-circuit board. The copper clad laminate comprises a dielectric substrate layer and a copper foil layer. The copper foil layer is located on at least one surface of the dielectric substrate layer, wherein the copper foil layer comprises an iron element in a weight content of less than 10 ppm, a nickel element in a weight content of less than 10 ppm, a cobalt element in a weight content of less than 10 ppm, and a molybdenum element in a weight content of 10 ppm. The copper clad laminate has a passive intermodulation PIM of less than −158 dBc (700 MHz/2600 MHz).