公开(公告)号：US20170321001A1

公开(公告)日：2017-11-09

申请号：US15534557

申请日：2015-05-27

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Huayang DENG ,  Zengbiao HUANG ,  Qianfa LIU ,  Zhongqiang YANG ,  Peng WANG

IPC: C08G59/66 ,  C08J5/04 ,  C08J11/04 ,  C08G59/24 ,  B32B15/092 ,  C08G59/56 ,  C08G59/50 ,  C08K3/36 ,  C08J5/24

CPC classification number: C08G59/66 ,  B32B15/092 ,  C08G59/245 ,  C08G59/504 ,  C08G59/56 ,  C08J3/243 ,  C08J5/043 ,  C08J5/24 ,  C08J11/04 ,  C08J11/16 ,  C08J11/18 ,  C08J2363/00 ,  C08J2363/02 ,  C08K3/36 ,  C08L63/00 ,  Y02W30/705 ,  Y02W30/706

Abstract: Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.

公开(公告)号：US20170342301A1

公开(公告)日：2017-11-30

申请号：US15537519

申请日：2015-05-27

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Zengbiao HUANG ,  Huayang DENG ,  Yongjing XU

IPC: C09J163/00 ,  C09J9/02 ,  C09J11/06 ,  C09J11/04 ,  C01B13/00

CPC classification number: C09J163/00 ,  C01B13/00 ,  C08G59/223 ,  C08G59/504 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C08K3/10

Abstract: The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.