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1.发明申请公开(公告)号：US20200224026A1
公开(公告)日：2020-07-16
申请号：US16633018
申请日：2017-11-02
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe SU , Zhongqiang YANG
Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
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2.发明申请公开(公告)号：US20200208057A1
公开(公告)日：2020-07-02
申请号：US16632997
申请日：2017-11-14
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe SU
Abstract: Provided are an intrinsic flame-retardant resin with a low polarity, and a preparation method therefor and the use thereof. The intrinsic flame-retardant resin with a low polarity has a structure as shown in formula I and is a phenolic compound or resin which is prepared by a three-step reaction of allyl etherification, rearrangement and terminating with a phosphorus-containing group. The resin does not contain polar hydroxyl groups in the molecular formula thereof, and has a stable molecular structure, low polarity and high reactivity, and does not generate polar hydroxyl groups during application and processing, thereby avoiding the influence of secondary hydroxyl groups on the performance of products thereof. While the resin improves the dielectric performance, same still has crosslinkable groups which lead to no significant change in high temperature resistance after curing. Introduction of the phosphorus-containing capping group allows the resin to have intrinsic flame-retardant performance. Using the resin in the preparation of a metal foil clad laminate facilitates reducing the dielectric constant and dielectric loss of the metal foil clad laminate, and results in higher high temperature resistance and improved flame retardancy, so that the metal foil clad laminate has a good comprehensive performance and broad application prospects.
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3.发明申请公开(公告)号：US20180263115A1
公开(公告)日：2018-09-13
申请号：US15841439
申请日：2017-12-14
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe SU , Duye LI , Shanyin YAN , Qianfa LIU , Zhongqiang YANG
CPC classification number: H05K1/0373 , B32B5/26 , B32B17/02 , B32B25/16 , B32B2262/101 , B32B2307/204 , C08J5/24 , C08J2300/24 , C08J2325/10 , C08J2400/26 , C08J2423/16 , H05K1/0237 , H05K1/0366 , H05K2201/0154 , H05K2201/0278 , H05K2201/068
Abstract: The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite comprises (1) from 20 to 70 parts by weight of a thermosetting mixture, comprising (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.
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4.发明申请公开(公告)号：US20200207899A1
公开(公告)日：2020-07-02
申请号：US16633012
申请日：2017-11-02
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe SU , Zhongqiang YANG
Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
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