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公开(公告)号：US20240110027A1
公开(公告)日：2024-04-04
申请号：US18270290
申请日：2021-03-19
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Cheng LUO , Yundong MENG , Shanyin YAN
CPC classification number: C08J5/244 , C08J5/249 , C08K5/0066 , C08L33/04 , C08L47/00 , C08L53/02 , C08L71/126 , H05K1/0366 , C08J2309/06 , C08J2315/00 , C08J2333/04 , C08J2353/02 , C08J2371/12 , C08K2201/005 , C08K2201/011 , C08L2203/30 , C08L2205/035 , C08L2312/02
Abstract: The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%-85%, the added amount of said component B is 10%-95%, and the added amount of said component C is 1%-70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.
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公开(公告)号：US20160007452A1
公开(公告)日：2016-01-07
申请号：US14647412
申请日：2014-02-19
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Shanyin YAN , Xianping ZENG , Yongjing XU , Zhongqiang YANG , Xiaosheng SU , Li Luo
CPC classification number: H05K1/0306 , C03C25/16 , C03C25/30 , C03C25/326 , C03C25/36 , C08J5/24 , C08J2323/20 , C08J2363/00 , C08J2371/12 , C08J2379/04 , H05K1/0366 , H05K1/0393 , H05K3/0011 , H05K3/0085 , H05K2201/029
Abstract: The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close dielectric constant (DK) to glass fabrics being used. The present invention further relates to bonding sheets prepared by the process, as well as circuit substrate. The process for preparing circuit substrate of the invention, which has a lower cost, does not need to upgrade or adjust the equipment. The circuit substrates prepared thereby have less warp-wise and weft-wise difference in dielectric constant, and thus can effectively solve the problem of signal time delay.
Abstract translation: 本发明涉及一种制备用于构成电路基板的接合片的方法，包括用玻璃织物预处理玻璃织物与具有相同或接近介电常数（DK）的预处理清漆。 本发明还涉及通过该方法制备的粘合片以及电路基片。 本发明的具有较低成本的电路基板的制造方法不需要升级或调整设备。 由此制备的电路基板在介电常数方面具有较少的经向和纬向差异，因此可以有效地解决信号时间延迟的问题。
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公开(公告)号：US20200247970A1
公开(公告)日：2020-08-06
申请号：US16523753
申请日：2019-07-26
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbin CHEN , Qianfa LIU , Shanyin YAN , Xianping ZENG , Cuiming DU
Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.
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公开(公告)号：US20200247947A1
公开(公告)日：2020-08-06
申请号：US16523735
申请日：2019-07-26
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbin CHEN , Qianfa LIU , Shanyin YAN , Xianping ZENG , Cuiming DU
IPC: C08G65/329 , C08K5/14 , C08J5/24 , C08K9/04 , C08K7/26 , C08K3/38 , C08F236/06 , C08L53/02
Abstract: A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.
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Patent Agency Ranking
公开(公告)号：US20240228765A1
公开(公告)日：2024-07-11
申请号：US18541487
申请日：2023-12-15
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Cheng LUO , Shanyin YAN , Jiangling ZHANG
IPC: C08L53/02 , C08J5/24 , C08L9/00 , C08L25/16 , C09D109/00 , C09D125/16 , C09D153/02 , H05K1/03
CPC classification number: C08L53/02 , C08J5/249 , C08L9/00 , C08L25/16 , C09D109/00 , C09D125/16 , C09D153/02 , H05K1/032 , C08J2309/00 , C08J2325/16 , C08J2353/02 , C08J2409/00 , C08J2425/16 , C08J2453/02
Abstract: Resin composition, insulating resin film and use thereof. The resin composition comprises the following components in parts by mass: 50-90 parts of a hydrogenated hydrocarbon resin and 10-50 parts of a benzocyclobutene resin; the benzocyclobutene resin comprises at least one structural unit A and at least one structural unit B. The hydrogenated hydrocarbon resin and the benzocyclobutene resin with a specific structure are both total-hydrocarbon structures, having low dielectric constant Dk, dielectric loss tangent Df, and water absorption rate. The benzocyclobutene resin can be thermally cured to obtain the high cross-linking density, high glass transition temperature, and excellent heat resistance. The resin composition and the insulating resin film prepared therewith have ultra-low dielectric constant and loss tangent, excellent dielectric properties, heat resistance, damp heat resistance, adhesion strength, and excellent mechanical properties such as flexibility, satisfying the performance requirements of electronic components being high frequency, high speed, and high integration.
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公开(公告)号：US20210307164A1
公开(公告)日：2021-09-30
申请号：US17162122
申请日：2021-01-29
Applicant: Shengyi Technology Co., Ltd.
Inventor： Weifeng YIN , Cui HUO , Rui LIU , Yongjing XU , Shanyin YAN
IPC: H05K1/03 , C09J153/02 , C09J179/08 , C09J171/12 , C09J11/06
Abstract: The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.
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公开(公告)号：US20210301130A1
公开(公告)日：2021-09-30
申请号：US17160011
申请日：2021-01-27
Applicant: Shengyi Technology Co., Ltd.
Inventor： Jianying SHI , Weifeng YIN , Yongjing XU , Shanyin YAN
IPC: C08L71/12 , C09J171/12 , C09J147/00 , C08L47/00 , C09D171/12 , C09D147/00 , B32B7/12 , B32B15/085 , B32B15/14 , B32B15/20
Abstract: The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.
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8.发明申请公开(公告)号：US20180263115A1
公开(公告)日：2018-09-13
申请号：US15841439
申请日：2017-12-14
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Minshe SU , Duye LI , Shanyin YAN , Qianfa LIU , Zhongqiang YANG
CPC classification number: H05K1/0373 , B32B5/26 , B32B17/02 , B32B25/16 , B32B2262/101 , B32B2307/204 , C08J5/24 , C08J2300/24 , C08J2325/10 , C08J2400/26 , C08J2423/16 , H05K1/0237 , H05K1/0366 , H05K2201/0154 , H05K2201/0278 , H05K2201/068
Abstract: The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite comprises (1) from 20 to 70 parts by weight of a thermosetting mixture, comprising (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.
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公开(公告)号：US20170238417A1
公开(公告)日：2017-08-17
申请号：US15316380
申请日：2015-12-07
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Shanyin YAN , Yongjing XU , Zhongqiang YANG , Yongming ZHU
IPC: H05K1/03 , C09D171/12 , D06M15/53 , H05K3/38 , D06M23/10 , D06M11/46 , D06M11/45 , D06M11/44 , C09D109/00 , D06M15/233
CPC classification number: H05K1/0306 , C03C25/1095 , C03C25/47 , C08K3/22 , C08K2003/222 , C08K2003/2227 , C08K2003/2241 , C09D109/00 , C09D171/12 , D06M11/44 , D06M11/45 , D06M11/46 , D06M15/233 , D06M15/53 , D06M23/10 , D06M2101/00 , H05K1/024 , H05K1/0366 , H05K1/0373 , H05K3/381
Abstract: The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.
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