Abstract:
The present invention proposes a low temperature poly-silicon thin-film transistor having a dual-gate structure and a method for forming the low temperature poly-silicon thin-film transistor. The low temperature poly-silicon thin-film transistor includes: a substrate, one or more patterned amorphous silicon (a-Si) layers, disposed in a barrier layer on the substrate, for forming a bottom gate, an NMOS disposed on the barrier layer, and a PMOS disposed on the barrier layer. The NMOS comprises a patterned gate electrode (GE) layer as a top gate, and the patterned GE layer and the bottom gate formed by the one or more patterned a-Si layers form a dual-gate structure. The present invention proposes a low temperature poly-silicon thin-film transistor with a more stabilized I-V characteristic, better driving ability, low power consumption, and higher production yield.
Abstract:
A manufacturing method of a flexible display is provided, which comprises steps of forming an silicon layer on a rigid substrate, forming a frame-type silicon layer from the silicon layer, attaching a flexible substrate onto the surface of the rigid substrate on which the frame-type amorphous silicon layer is formed, forming a display film on the flexible substrate, and dehydrogenating the frame-type silicon layer after the formation of the display film is complete, so that the flexible substrate is separated from the frame-type silicon layer for obtaining the flexible display. The manufacturing method of the flexible display prevents the problem of low yield rate caused by the damage to the plastic substrate in the separation process.
Abstract:
A manufacturing method of a flexible display is provided, which comprises steps of forming an silicon layer on a rigid substrate, forming a frame-type silicon layer from the silicon layer, attaching a flexible substrate onto the surface of the rigid substrate on which the frame-type amorphous silicon layer is formed, forming a display film on the flexible substrate, and dehydrogenating the frame-type silicon layer after the formation of the display film is complete, so that the flexible substrate is separated from the frame-type silicon layer for obtaining the flexible display. The manufacturing method of the flexible display prevents the problem of low yield rate caused by the damage to the plastic substrate in the separation process.