公开(公告)号：US12278120B2

公开(公告)日：2025-04-15

申请号：US17704135

申请日：2022-03-25

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Minami Nakamura ,  Kensuke Demura

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate treatment device includes a placement platform rotating a substrate, a cooling part supplying a cooling gas to a space between the placement platform and the substrate, a liquid supplier supplying a liquid to a surface of the substrate opposite to the placement platform side, a detector that is above the surface of the substrate and detects a freezing start of the liquid, and a controller controlling the substrate rotation, the cooling gas supply, and the liquid supply. The controller controls at least one of the substrate rotation, the cooling gas flow rate, or the liquid supply rate, and causes the liquid on the substrate surface to reach a supercooled state; and when determining based on a signal from the detector that the freezing of the supercooled liquid has started, the controller starts thawing the frozen liquid after a prescribed interval has elapsed from the freezing start of the liquid.

公开(公告)号：US12109597B2

公开(公告)日：2024-10-08

申请号：US17230152

申请日：2021-04-14

Applicant: Shibaura Mechatronics Corporation

Inventor： Daisuke Matsushima ,  Kensuke Demura ,  Satoshi Nakamura ,  Masaya Kamiya ,  Minami Nakamura

IPC: B08B7/00 ,  B08B3/04 ,  B08B3/08 ,  B08B3/10 ,  F25C1/12 ,  H01L21/67

CPC classification number: B08B7/0014 ,  B08B3/041 ,  B08B3/08 ,  B08B3/10 ,  F25C1/12 ,  H01L21/67028

Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

公开(公告)号：US12138671B2

公开(公告)日：2024-11-12

申请号：US17181227

申请日：2021-02-22

Applicant: Shibaura Mechatronics Corporation

Inventor： Minami Nakamura ,  Daisuke Matsushima ,  Kensuke Demura

IPC: B08B7/00 ,  B08B3/10 ,  B08B7/04 ,  G03F7/00 ,  G03F7/20 ,  H01L21/67 ,  H01L21/687 ,  G03F1/82

Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand side, a detector configured to detect a state of the liquid on the surface of the substrate, and a controller controlling at least one of a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, obtains a temperature of the liquid in the supercooled state at a start of freezing, and is configured to calculate a removal ratio of a contamination.