公开(公告)号：US20240071744A1

公开(公告)日：2024-02-29

申请号：US18239371

申请日：2023-08-29

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yotaro FUKUOKA

IPC: H01L21/02 ,  H01L21/304 ,  H01L21/67

CPC classification number: H01L21/02052 ,  H01L21/304 ,  H01L21/67051 ,  H01L21/67253

Abstract: According to one embodiment of the present disclosure, a substrate cleaning apparatus includes a hydrophilization chamber connected to a polishing apparatus and that accommodates a substrate having a polished surface polished by the polishing apparatus; a support provided in the hydrophilization chamber; a liquid supply unit that supplies a cleaning liquid to the polished surface of the substrate to hydrophilize the polished surface; an imaging unit that captures an image of the polished surface supplied with the cleaning liquid; a determination unit that determines whether hydrophilization is achieved on a basis of the image; an adjustment unit that adjusts the supply of the cleaning solution by the liquid supply unit depending on a determination result obtained by the determination unit; and a cleaning chamber connected to the hydrophilization chamber and that cleans the polished surface hydrophilized by the cleaning liquid.

公开(公告)号：US20170183769A1

公开(公告)日：2017-06-29

申请号：US15308638

申请日：2016-02-29

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yotaro FUKUOKA ,  Sosuke YAGI

IPC: C23C14/54 ,  H01J37/34 ,  C23C14/34 ,  H01J37/32 ,  C23C14/50

Abstract: A film formation apparatus and a film-formed workpiece manufacturing method which are capable of forming a film with a uniform thickness on a workpiece like a three-dimensional object that includes a plurality of surfaces by a simple structure are provided. A film formation apparatus includes a target 21 that is a film formation material including a plane SU3, a power supply unit 3 applying power to the target 21, a rotating unit 4 rotating a workpiece W that is a film formation object around a rotation axis AX1, and a revolving unit 5 revolving the rotating unit 4 around a revolution axis AX2 separate from the rotation axis AX1 to repeatedly make the workpiece W to come close to and move apart from the target 21.