公开(公告)号：US20190176457A1

公开(公告)日：2019-06-13

申请号：US16307820

申请日：2017-05-30

Applicant: SHOWA DENKO PACKAGING CO., LTD.

Inventor： Kensuke NAGATA ,  Tsutomu GANSE

IPC: B32B43/00 ,  B32B15/085 ,  B32B15/088 ,  B32B15/20 ,  H01M2/02 ,  H01M10/058 ,  B32B7/12 ,  B23K26/38

Abstract: A laminate material with a metal exposed portion is efficiently produced. A peeling step is performed in which a laser beam L is irradiated on a resin layer 17, 18 of a laminate raw material 10 in which a resin layer 17, 18 is laminated on at least one surface of a metal foil 11 to peel the resin layer 17, 18 and the metal foil 11 to thereby form a peeled portion 21, 22. Thereafter, the resin layers 17 and 18 corresponding to the peeled portions 21 and 22 are cut off to expose the metal foil 11.

公开(公告)号：US20190214611A1

公开(公告)日：2019-07-11

申请号：US16307592

申请日：2017-05-30

Applicant: SHOWA DENKO PACKAGING CO., LTD.

Inventor： Kensuke NAGATA ,  Tsutomu GANSE

IPC: H01M2/02 ,  H01G9/04 ,  H01G9/08 ,  H01G9/022 ,  H01G9/02

CPC classification number: H01M2/0287 ,  B32B15/08 ,  H01G9/02 ,  H01G9/022 ,  H01G9/04 ,  H01G9/08 ,  H01G11/78 ,  H01M2/02 ,  H01M2/028 ,  H01M2/0285 ,  H01M2002/0297

Abstract: Provided is a laminate material capable of easily forming a metal exposed portion. The laminate material 1 is a laminate material formed by bonding and laminating a resin layer 17, 18 on at least one surface of a metal foil 11. A recess 27, 28 in which a foil thickness of the metal foil 11 is reduced is formed on a part of a bonding surface of the metal foil. A peeled portion 21, 22 where the resin layer 17, 18 corresponding to the recess 27, 28 has been peeled from the metal foil 11 is formed.