公开(公告)号：US20180179418A1

公开(公告)日：2018-06-28

申请号：US15551585

申请日：2016-03-02

Applicant: SIKA TECHNOLOGY AG

Inventor： Matthias GÖSSI ,  Stefan KEISER ,  Josef LUSSI

IPC: C09J5/06 ,  C09J7/24 ,  C09J7/35 ,  C09J5/08 ,  C08J9/10 ,  B32B37/06 ,  B32B37/12 ,  B32B15/08

CPC classification number: C09J5/06 ,  B32B15/08 ,  B32B37/06 ,  B32B37/1207 ,  B32B2037/1215 ,  C08J9/103 ,  C08J2203/04 ,  C08J2207/02 ,  C08J2331/04 ,  C08K5/23 ,  C09J5/08 ,  C09J7/22 ,  C09J7/245 ,  C09J7/35 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2205/31 ,  C09J2423/00 ,  C09J2423/04 ,  C09J2427/006 ,  C09J2431/00 ,  C09J2463/006 ,  C09J2475/006 ,  E04D5/10 ,  E04D5/148 ,  E04D5/149 ,  E04F15/16 ,  E04F2201/07

Abstract: A method for sealing a substrate having one or a number of electrically conductive surface regions, including the (i) arranging of a sealing membrane, having a plastic layer and an outer adhesive layer made of a melt adhesive, on the substrate, wherein the adhesive layer is facing towards the substrate, (ii) the positioning of an induction heating device over the sealing membrane, and (iii) heating the melt adhesive for the fusion or partial melting thereof by means of the inductive heating of the electrically conductive surface regions with the induction heating device, in order to adhere the sealing membrane to the substrate after cooling. The method facilitates the sealing of substrates with sealing membranes. Same is suitable, in particular, for sealing floors or ceilings or parts thereof.

公开(公告)号：US20240417598A1

公开(公告)日：2024-12-19

申请号：US18701393

申请日：2022-11-14

Applicant: SIKA TECHNOLOGY AG

Inventor： Markus HAUFE ,  Cyrill GUT ,  Ramon BUCHER ,  Josef LUSSI ,  Helena WALLIMANN ,  Simon SCHOENBRODT

IPC: C09J7/24 ,  C09J123/22 ,  C09J133/08

Abstract: A sealing element includes a carrier layer having a first and a second major surface, a pressure sensitive adhesive layer having a thickness of at least 100 μm, and optionally a release liner covering at least a portion of an outer major surface of the pressure sensitive adhesive layer facing away from the carrier layer, wherein the carrier layer includes at least one elastomer E and/or at least one thermoplastic vulcanizate TPV and has a thickness of at least 0.2 mm.