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公开(公告)号:US20240417598A1
公开(公告)日:2024-12-19
申请号:US18701393
申请日:2022-11-14
Applicant: SIKA TECHNOLOGY AG
Inventor: Markus HAUFE , Cyrill GUT , Ramon BUCHER , Josef LUSSI , Helena WALLIMANN , Simon SCHOENBRODT
IPC: C09J7/24 , C09J123/22 , C09J133/08
Abstract: A sealing element includes a carrier layer having a first and a second major surface, a pressure sensitive adhesive layer having a thickness of at least 100 μm, and optionally a release liner covering at least a portion of an outer major surface of the pressure sensitive adhesive layer facing away from the carrier layer, wherein the carrier layer includes at least one elastomer E and/or at least one thermoplastic vulcanizate TPV and has a thickness of at least 0.2 mm.
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公开(公告)号:US20220073688A1
公开(公告)日:2022-03-10
申请号:US17422487
申请日:2020-03-19
Applicant: SIKA TECHNOLOGY AG
Inventor: Marcel OERTLI , Robert ROSKAMP , Helena WALLIMANN , Christoph FÄH , Fabien CHOFFAT
Abstract: A method for adhesively bonding two substrates by means of a moisture-curable adhesive composition, wherein at least one of the substrates includes at least 40 wt.-% of a mixture, said mixture consisting of: between 15 and 99 wt.-% of at least one thermoplastic polymer; between 1 and 85 wt.-% of at least one elastomer; and wherein the moisture-curable adhesive composition includes: at least one polymer containing silane groups; between 10 and 40 wt.-% of at least one polymeric plasticizer; between 0.1 and 5 wt.-% of at least one amino-functional alkoxysilane; between 0 and 5 wt.-% of at least one C1-C12-alkyl-functional alkoxysilane. The method yields adhesively bonded substrates without the requirements of using migrating plasticizers and pre-treating of the substrates.
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公开(公告)号:US20230357549A1
公开(公告)日:2023-11-09
申请号:US18013413
申请日:2021-07-02
Applicant: SIKA TECHNOLOGY AG
Inventor: Jean-Luc SCHLÄPFER , Robert ROSKAMP , Christoph FÄH , Harald PFISTERER , Ramon BUCHER , Helena WALLIMANN
IPC: C08L23/14 , C08J5/18 , C09K3/00 , C09J5/00 , C09J175/08
CPC classification number: C08L23/142 , C08J5/18 , C09K3/00 , C09J5/00 , C09J175/08 , C08L2207/04 , C08L2205/025 , C08L2205/035 , C08L2203/162 , C08L2203/30 , C09K2200/0642 , C09K2200/062 , C09J2423/108 , C09J2423/048 , C09J2423/168 , C09J2475/00 , C08J2323/14 , C08J2423/08 , C08J2423/16
Abstract: A thermoplastic composition including a thermoplastic polymer component and at least one elastomer, wherein the thermoplastic polymer component comprises at least one propylene copolymer having a propylene content of at least 60 wt.-% and at least one ethylene copolymer having an ethylene content of at least 50 wt.-%. The invention is also directed to a sealing device comprising a waterproofing layer obtained by using the thermoplastic composition, to a method for producing a sealing device, to a method for waterproofing a substrate, and to a method for bonding a first substrate to a second substrate.
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