公开(公告)号：US20230282586A1

公开(公告)日：2023-09-07

申请号：US17740796

申请日：2022-05-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chao-Chiang Pu ,  Chi-Ching Ho ,  Yi-Min Fu ,  Yu-Po Wang ,  Shuai-Lin Liu

IPC: H01L23/538 ,  H01L25/10 ,  H01L23/48 ,  H01L25/00

CPC classification number: H01L23/5381 ,  H01L25/105 ,  H01L23/481 ,  H01L25/50 ,  H01L23/5386 ,  H01L24/16

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

公开(公告)号：US12176291B2

公开(公告)日：2024-12-24

申请号：US17740796

申请日：2022-05-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chao-Chiang Pu ,  Chi-Ching Ho ,  Yi-Min Fu ,  Yu-Po Wang ,  Shuai-Lin Liu

IPC: H01L21/00 ,  H01L23/48 ,  H01L23/538 ,  H01L25/00 ,  H01L25/10 ,  H01L23/00

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

公开(公告)号：US20230378072A1

公开(公告)日：2023-11-23

申请号：US17857887

申请日：2022-07-05

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Shuai-Lin Liu ,  Nai-Hao Kao ,  Chao-Chiang Pu ,  Yi-Min Fu ,  Yu-Po Wang

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/5381 ,  H01L25/0655 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/49816 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/49838 ,  H01L23/49822 ,  H01L21/4857 ,  H01L24/16

Abstract: An electronic package is provided, in which a plurality of electronic elements are disposed on a plurality of carrier structures, and at least one bridging element is disposed between at least two of the carrier structures to electrically bridge the two carrier structures. Therefore, when there is a need to increase the function of the electronic package, only one electronic element is arranged on a single carrier structure, and there is no need to increase the panel area of the carrier structure, so as to facilitate the control of the panel area of the carrier structure and avoid warpage of the carrier structure due to the oversized panel.