公开(公告)号：US20230282586A1

公开(公告)日：2023-09-07

申请号：US17740796

申请日：2022-05-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chao-Chiang Pu ,  Chi-Ching Ho ,  Yi-Min Fu ,  Yu-Po Wang ,  Shuai-Lin Liu

IPC: H01L23/538 ,  H01L25/10 ,  H01L23/48 ,  H01L25/00

CPC classification number: H01L23/5381 ,  H01L25/105 ,  H01L23/481 ,  H01L25/50 ,  H01L23/5386 ,  H01L24/16

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

公开(公告)号：US20230378072A1

公开(公告)日：2023-11-23

申请号：US17857887

申请日：2022-07-05

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Shuai-Lin Liu ,  Nai-Hao Kao ,  Chao-Chiang Pu ,  Yi-Min Fu ,  Yu-Po Wang

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/5381 ,  H01L25/0655 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/49816 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/49838 ,  H01L23/49822 ,  H01L21/4857 ,  H01L24/16

Abstract: An electronic package is provided, in which a plurality of electronic elements are disposed on a plurality of carrier structures, and at least one bridging element is disposed between at least two of the carrier structures to electrically bridge the two carrier structures. Therefore, when there is a need to increase the function of the electronic package, only one electronic element is arranged on a single carrier structure, and there is no need to increase the panel area of the carrier structure, so as to facilitate the control of the panel area of the carrier structure and avoid warpage of the carrier structure due to the oversized panel.

公开(公告)号：US12199047B2

公开(公告)日：2025-01-14

申请号：US17572001

申请日：2022-01-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chao-Chiang Pu ,  Chi-Ching Ho ,  Yi-Min Fu ,  Yu-Po Wang ,  Po-Yuan Su

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/58 ,  H01L23/42 ,  H05K1/02

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.

公开(公告)号：US20240038685A1

公开(公告)日：2024-02-01

申请号：US17950914

申请日：2022-09-22

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chao-Chiang Pu ,  Chi-Ching Ho ,  Yi-Min Fu ,  Yu-Po Wang ,  Fang-Lin Tsai

IPC: H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L23/538 ,  H01L21/48

CPC classification number: H01L23/562 ,  H01L24/16 ,  H01L24/73 ,  H01L24/32 ,  H01L25/105 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5381 ,  H01L23/5385 ,  H01L23/5386 ,  H01L21/4817 ,  H01L2924/37001 ,  H01L2924/3511 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16235

Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.

公开(公告)号：US12176291B2

公开(公告)日：2024-12-24

申请号：US17740796

申请日：2022-05-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chao-Chiang Pu ,  Chi-Ching Ho ,  Yi-Min Fu ,  Yu-Po Wang ,  Shuai-Lin Liu

IPC: H01L21/00 ,  H01L23/48 ,  H01L23/538 ,  H01L25/00 ,  H01L25/10 ,  H01L23/00

Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.

公开(公告)号：US20230253331A1

公开(公告)日：2023-08-10

申请号：US17897523

申请日：2022-08-29

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yi-Min Fu ,  Chi-Ching Ho ,  Chao-Chiang Pu ,  Yu-Po Wang

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/10 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/5381 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L23/5385 ,  H01L23/5386 ,  H01L21/565 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3128 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/182 ,  H01L2924/3511 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/107

Abstract: An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.

公开(公告)号：US20230154865A1

公开(公告)日：2023-05-18

申请号：US17572001

申请日：2022-01-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chao-Chiang Pu ,  Chi-Ching Ho ,  Yi-Min Fu ,  Yu-Po Wang ,  Po-Yuan Su

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/367 ,  H01L23/31 ,  H01L21/48 ,  H01L23/58

CPC classification number: H01L23/562 ,  H01L23/49822 ,  H01L23/367 ,  H01L23/3107 ,  H01L21/4882 ,  H01L23/585

Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.