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1.发明授权Package substrate with band stop filter and semiconductor package including the same 有权具有带阻滤波器的封装衬底和包括其的半导体封装公开(公告)号：US09231286B2
公开(公告)日：2016-01-05
申请号：US13901297
申请日：2013-05-23
Applicant: SK hynix Inc.
Inventor： Byung Jun Bang , Sang Joon Lim , Ju Il Eom , Bok Kyu Choi , Jin Hwan Song
CPC classification number: H01P1/2039 , H01L2924/0002 , H01P1/203 , H05K1/0236 , H05K1/16 , H05K2201/09236 , H05K2201/09354 , H05K2201/09781 , H01L2924/00
Abstract: According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.
Abstract translation: 根据一个实施例，半导体封装包括带阻滤波器，其包括：布置在封装衬底上的传输线图案; 以及在与传输线图案分离的状态下沿着传输线图案布置的导电短截线图案。
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