公开(公告)号：US10157858B2

公开(公告)日：2018-12-18

申请号：US15856695

申请日：2017-12-28

Applicant: SK hynix Inc.

Inventor： Won Duck Jung ,  Sang Joon Lim ,  Sung Mook Lim

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/482

Abstract: Disclosed is a semiconductor package. The semiconductor package may include a substrate a semiconductor chip mounted over a surface of the substrate such that an active surface of the semiconductor chip faces the surface of the substrate. The semiconductor chip and substrate may be configured for shielding or scattering electromagnetic waves.

公开(公告)号：US10115708B2

公开(公告)日：2018-10-30

申请号：US15443509

申请日：2017-02-27

Applicant: SK hynix Inc.

Inventor： Ju Il Eom ,  Jae Hoon Lee ,  Sang Joon Lim

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package may include a first semiconductor chip having first bonding pads on a first active surface. The semiconductor package may include a second semiconductor chip having second bonding pads which are arranged on a second active surface. The first and second semiconductor chips are stacked such that the first and second active surfaces face each other.

公开(公告)号：US10923434B2

公开(公告)日：2021-02-16

申请号：US16183538

申请日：2018-11-07

Applicant: SK hynix Inc.

Inventor： Bok Kyu Choi ,  Juil Eom ,  Sang Joon Lim

IPC: H01L23/498 ,  H01L23/552

Abstract: A semiconductor package may include a chip disposed on a substrate, a conductive structure disposed on the substrate to include a conductive structure frame including a side surface facing at least one side surface of the chip and to include conductive structure fingers extending from the conductive structure frame toward an edge of the substrate, and an electromagnetic interference (EMI) shielding layer covering the chip and the conductive structure and contacting a side surface of an end of one or more of the conductive structure fingers.

公开(公告)号：US09609742B2

公开(公告)日：2017-03-28

申请号：US14014652

申请日：2013-08-30

Applicant: SK hynix Inc.

Inventor： Eul Chul Jang ,  Qwan Ho Chung ,  Sang Joon Lim ,  Sung Woo Han

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/02 ,  H01L23/498 ,  H01L23/552

CPC classification number: H05K1/0224 ,  H01L23/49838 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0253 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09681 ,  H05K2201/097 ,  H05K2201/09727 ,  H01L2924/00

Abstract: Package substrates are provided. The package substrate may include a power line and a ground line on a first surface of a substrate body; a plurality of signal lines on the first surface between the power line and the ground line; and a lower ground pattern and a lower power pattern positioned on a second surface of the substrate body opposite to the first surface. The lower ground pattern may be disposed to be opposite to the power line and the lower power pattern may be disposed to be opposite to the ground line. Related semiconductor packages are also provided.

公开(公告)号：US09231286B2

公开(公告)日：2016-01-05

申请号：US13901297

申请日：2013-05-23

Applicant: SK hynix Inc.

Inventor： Byung Jun Bang ,  Sang Joon Lim ,  Ju Il Eom ,  Bok Kyu Choi ,  Jin Hwan Song

IPC: H01P1/203 ,  H05K1/02 ,  H05K1/16

CPC classification number: H01P1/2039 ,  H01L2924/0002 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/16 ,  H05K2201/09236 ,  H05K2201/09354 ,  H05K2201/09781 ,  H01L2924/00

Abstract: According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.

Abstract translation: 根据一个实施例，半导体封装包括带阻滤波器，其包括：布置在封装衬底上的传输线图案; 以及在与传输线图案分离的状态下沿着传输线图案布置的导电短截线图案。