公开(公告)号：US20160366770A1

公开(公告)日：2016-12-15

申请号：US15186022

申请日：2016-06-17

Applicant: SONY CORPORATION

Inventor： Thomas MERKLE ,  Stefan KOCH ,  Joo-Young CHOI

IPC: H05K3/46 ,  H01L23/498 ,  H05K3/30 ,  H01L23/66 ,  H05K1/02 ,  H05K1/18 ,  H01L23/538

CPC classification number: H05K3/4697 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/16 ,  H05K1/185 ,  H05K3/301 ,  H05K3/465 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2203/1469 ,  H01L2924/00

Abstract: The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

Abstract translation: 本发明涉及以毫米波和太赫兹频率工作的集成电子系统的领域。 提出了一种单片多芯片封装，这种封装的载体结构以及用于制造这种封装和这种载体结构的制造方法，以获得完全屏蔽mm波/ THz系统的不同功能的封装。 通过聚合光敏单体将包装倒入适当位置。 它逐渐在MMIC（单片微波集成电路）之上和之上增长，连接到MMIC，但使芯片的高频区域变得困难。 所提出的方法导致电磁完全屏蔽的功能块。 这些单元可以根据系统需要进行组合和级联。