公开(公告)号：US20200273897A1

公开(公告)日：2020-08-27

申请号：US16807049

申请日：2020-03-02

申请人： SONY CORPORATION

发明人： Atsushi YAMAMOTO ,  Shinji MIYAZAWA ,  Yutaka OOKA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Naoki OGAWA ,  Nobutoshi FUJII ,  Shunsuke FURUSE ,  Masaya NAGATA ,  Yuichi YAMAMOTO

IPC分类号： H01L27/146

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US20190043910A1

公开(公告)日：2019-02-07

申请号：US16085415

申请日：2017-03-10

申请人： SONY CORPORATION

发明人： Shinji MIYAZAWA ,  Yoshiaki MASUDA

IPC分类号： H01L27/146 ,  H04N5/369

摘要： The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size.The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like.

公开(公告)号：US20180331142A1

公开(公告)日：2018-11-15

申请号：US16045973

申请日：2018-07-26

申请人： SONY CORPORATION

发明人： Atsushi YAMAMOTO ,  Shinji MIYAZAWA ,  Yutaka OOKA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Naoki OGAWA ,  Nobutoshi FUJII ,  Shunsuke FURUSE ,  Masaya NAGATA ,  Yuichi YAMAMOTO

IPC分类号： H01L27/146 ,  H01L31/0203

CPC分类号： H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/11

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US20190244996A1

公开(公告)日：2019-08-08

申请号：US16389052

申请日：2019-04-19

申请人： SONY CORPORATION

发明人： Takaaki HIRANO ,  Shinji MIYAZAWA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Shunsuke FURUSE ,  Yutaka OOKA

IPC分类号： H01L27/146

CPC分类号： H01L27/14627 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/1464 ,  H01L27/14685 ,  H04N5/374

摘要： Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.

公开(公告)号：US20180190700A1

公开(公告)日：2018-07-05

申请号：US15910274

申请日：2018-03-02

申请人： SONY CORPORATION

发明人： Takaaki HIRANO ,  Shinji MIYAZAWA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Shunsuke FURUSE ,  Yutaka OOKA

IPC分类号： H01L27/146 ,  H04N5/374

CPC分类号： H01L27/14627 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/1464 ,  H01L27/14685 ,  H04N5/374

摘要： Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.

公开(公告)号：US20170287964A1

公开(公告)日：2017-10-05

申请号：US15621871

申请日：2017-06-13

申请人： SONY CORPORATION

发明人： Takaaki HIRANO ,  Shinji MIYAZAWA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Shunsuke FURUSE ,  Yutaka OOKA

IPC分类号： H01L27/146

CPC分类号： H01L27/14627 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/1464 ,  H01L27/14685 ,  H04N5/374

摘要： Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.

公开(公告)号：US20210305300A1

公开(公告)日：2021-09-30

申请号：US17144947

申请日：2021-01-08

申请人： SONY CORPORATION

发明人： Atsushi YAMAMOTO ,  Shinji MIYAZAWA ,  Yutaka OOKA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Naoki OGAWA ,  Nobutoshi FUJII ,  Shunsuke FURUSE ,  Masaya NAGATA ,  Yuichi YAMAMOTO

IPC分类号： H01L27/146

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip.
Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US20170271389A1

公开(公告)日：2017-09-21

申请号：US15476629

申请日：2017-03-31

申请人： SONY CORPORATION

发明人： Atsushi YAMAMOTO ,  Shinji MIYAZAWA ,  Yutaka OOKA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Naoki OGAWA ,  Nobutoshi FUJII ,  Shunsuke FURUSE ,  Masaya NAGATA ,  Yuichi YAMAMOTO

IPC分类号： H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/11

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US20170236860A1

公开(公告)日：2017-08-17

申请号：US15111003

申请日：2015-01-26

申请人： SONY CORPORATION

发明人： Atsushi YAMAMOTO ,  Shinji MIYAZAWA ,  Yutaka OOKA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Naoki OGAWA ,  Nobutoshi FUJII ,  Shunsuke FURUSE ,  Masaya NAGATA ,  Yuichi YAMAMOTO

IPC分类号： H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/11

摘要： The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US20210134861A1

公开(公告)日：2021-05-06

申请号：US17148207

申请日：2021-01-13

申请人： SONY CORPORATION

发明人： Harumi TANAKA ,  Yoshiaki MASUDA ,  Shinji MIYAZAWA ,  Minoru ISHIDA

IPC分类号： H01L27/146 ,  G01N21/78 ,  G01N21/64 ,  H01L23/48 ,  H01L31/054 ,  H04N5/369 ,  H04N5/349

摘要： The present disclosure relates to reducing the size of a solid-state imaging apparatus. The solid-state imaging apparatus is configured by laminating a first structure body, comprising a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned, and a second structure body, comprising an output circuit unit for outputting a pixel signal. The output circuit unit, including a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit.