公开(公告)号：US20140217431A1

公开(公告)日：2014-08-07

申请号：US14165014

申请日：2014-01-27

Applicant: Sony Corporation

Inventor： Kenichi AOYAGI ,  Nobutoshi FUJII

IPC: H01L33/60 ,  H01L25/075

CPC classification number: H01L51/5284 ,  G02B1/118 ,  H01L27/322 ,  H01L51/524 ,  H01L2251/5315

Abstract: There is provided a display device including a plurality of light emitting elements over a first substrate, and an anti-reflection member configured to prevent reflection of light from a first substrate side at a boundary portion in a pixel region corresponding to each of the light emitting elements, the anti-reflection member being on a second substrate side where a second substrate faces the first substrate.

Abstract translation: 提供了一种显示装置，其包括在第一基板上的多个发光元件，以及防反射部件，被配置为防止来自与发光的每一个对应的像素区域的边界部分处的来自第一基板侧的光的反射 所述防反射部件位于第二基板侧，所述第二基板面向所述第一基板。

公开(公告)号：US20160233264A1

公开(公告)日：2016-08-11

申请号：US15023783

申请日：2014-09-19

Applicant: SONY CORPORATION

Inventor： Yoshihisa KAGAWA ,  Nobutoshi FUJII ,  Masanaga FUKASAWA ,  Tokihisa KANEGUCHI ,  Yoshiya HAGIMOTO ,  Kenichi AOYAGI ,  Ikue MITSUHASHI

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L25/065 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2224/04042 ,  H01L2224/08121 ,  H01L2224/08145 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/9202 ,  H01L2224/03

Abstract: The present technology relates to a semiconductor device and a solid-state imaging device of which crack resistance can be improved in a simpler way. The semiconductor device has an upper substrate that is constituted by a Si substrate and wiring layers laminated on the Si substrate and a second substrate that is constituted by a Si substrate and wiring layers laminated on the Si substrate and is joined to the upper substrate. In addition, a pad for wire bonding or probing is formed in the upper substrate, and pads for protecting corner or side parts of the pad for wire bonding or probing are radially laminated and provided in each of the wiring layers between the pad and the Si substrate of the lower substrate. The present technology can be applied to a solid-state imaging device.

Abstract translation: 本技术涉及一种可以以更简单的方式提高抗裂性的半导体器件和固态成像器件。 半导体器件具有由Si衬底和层叠在Si衬底上的布线层构成的上衬底和由Si衬底和层叠在Si衬底上的布线层构成的第二衬底，并与上衬底接合。 此外，在上基板中形成用于引线接合或探测的焊盘，并且用于保护用于引线接合或探测的焊盘的角部或侧部的焊盘被径向地层压并设置在焊盘和Si之间的每个布线层中 下基板的基板。 本技术可以应用于固态成像装置。

公开(公告)号：US20200273897A1

公开(公告)日：2020-08-27

申请号：US16807049

申请日：2020-03-02

Applicant: SONY CORPORATION

Inventor： Atsushi YAMAMOTO ,  Shinji MIYAZAWA ,  Yutaka OOKA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Naoki OGAWA ,  Nobutoshi FUJII ,  Shunsuke FURUSE ,  Masaya NAGATA ,  Yuichi YAMAMOTO

IPC: H01L27/146

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US20180331142A1

公开(公告)日：2018-11-15

申请号：US16045973

申请日：2018-07-26

Applicant: SONY CORPORATION

Inventor： Atsushi YAMAMOTO ,  Shinji MIYAZAWA ,  Yutaka OOKA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Naoki OGAWA ,  Nobutoshi FUJII ,  Shunsuke FURUSE ,  Masaya NAGATA ,  Yuichi YAMAMOTO

IPC: H01L27/146 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/11

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US20180108697A1

公开(公告)日：2018-04-19

申请号：US15567289

申请日：2016-07-15

Applicant: SONY CORPORATION

Inventor： Hiroyasu MATSUGAI ,  Hiroyuki ITOU ,  Suguru SAITO ,  Keiji OHSHIMA ,  Masanori IWASAKI ,  Toshihiko HAYASHI ,  Shuzo SATO ,  Nobutoshi FUJII ,  Hiroshi TAZAWA ,  Toshiaki SHIRAIWA ,  Minoru ISHIDA

IPC: H01L27/146 ,  G02B13/00 ,  B29D11/00

CPC classification number: H01L27/14627 ,  B29D11/00375 ,  G02B1/11 ,  G02B13/0085 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687

Abstract: A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

公开(公告)号：US20140240370A1

公开(公告)日：2014-08-28

申请号：US14176656

申请日：2014-02-10

Applicant: Sony Corporation

Inventor： Takashi SAKAIRI ,  Yoshiya HAGIMOTO ,  Hayato IWAMOTO ,  Koichiro SAGA ,  Nobutoshi FUJII

IPC: G09G3/32

CPC classification number: G09G3/3225 ,  G09G2320/0233 ,  G09G2320/046 ,  G09G2360/142 ,  G09G2360/148 ,  Y10T29/49

Abstract: A display includes: a light-emitting section provided in a display region; and a light-receiving section provided in the display region, and configured to receive light from the light-emitting section.

Abstract translation: 显示器包括：设置在显示区域中的发光部分; 以及设置在所述显示区域中并被配置为从所述发光部接收光的受光部。

公开(公告)号：US20180286911A1

公开(公告)日：2018-10-04

申请号：US16001278

申请日：2018-06-06

Applicant: SONY CORPORATION

Inventor： Yoshihisa KAGAWA ,  Nobutoshi FUJII ,  Masanaga FUKASAWA ,  Tokihisa KANEGUCHI ,  Yoshiya HAGIMOTO ,  Kenichi AOYAGI ,  Ikue MITSUHASHI

IPC: H01L27/146 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L21/768

Abstract: The present technology relates to a semiconductor device and a solid-state imaging device of which crack resistance can be improved in a simpler way. The semiconductor device has an upper substrate that is constituted by a Si substrate and wiring layers laminated on the Si substrate and a second substrate that is constituted by a Si substrate and wiring layers laminated on the Si substrate and is joined to the upper substrate. In addition, a pad for wire bonding or probing is formed in the upper substrate, and pads for protecting corner or side parts of the pad for wire bonding or probing are radially laminated and provided in each of the wiring layers between the pad and the Si substrate of the lower substrate. The present technology can be applied to a solid-state imaging device.

公开(公告)号：US20210305300A1

公开(公告)日：2021-09-30

申请号：US17144947

申请日：2021-01-08

Applicant: SONY CORPORATION

Inventor： Atsushi YAMAMOTO ,  Shinji MIYAZAWA ,  Yutaka OOKA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Naoki OGAWA ,  Nobutoshi FUJII ,  Shunsuke FURUSE ,  Masaya NAGATA ,  Yuichi YAMAMOTO

IPC: H01L27/146

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip.
Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US20200006415A1

公开(公告)日：2020-01-02

申请号：US16564444

申请日：2019-09-09

Applicant: SONY CORPORATION

Inventor： Hiroyasu MATSUGAI ,  Hiroyuki ITOU ,  Suguru SAITO ,  Keiji OHSHIMA ,  Masanori IWASAKI ,  Toshihiko HAYASHI ,  Shuzo SATO ,  Nobutoshi FUJII ,  Hiroshi TAZAWA ,  Toshiaki SHIRAIWA ,  Minoru ISHIDA

IPC: H01L27/146 ,  B29D11/00 ,  G02B13/00

Abstract: A deformation of a stacked lens is suppressed.A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

公开(公告)号：US20170271389A1

公开(公告)日：2017-09-21

申请号：US15476629

申请日：2017-03-31

Applicant: SONY CORPORATION

Inventor： Atsushi YAMAMOTO ,  Shinji MIYAZAWA ,  Yutaka OOKA ,  Kensaku MAEDA ,  Yusuke MORIYA ,  Naoki OGAWA ,  Nobutoshi FUJII ,  Shunsuke FURUSE ,  Masaya NAGATA ,  Yuichi YAMAMOTO

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/11

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.