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公开(公告)号:US20150125375A1
公开(公告)日:2015-05-07
申请号:US14532098
申请日:2014-11-04
Applicant: SPTS TECHNOLOGIES LIMITED
Inventor: YUN ZHOU , RHONDA HYNDMAN , STEPHEN R. BURGESS
CPC classification number: C23C14/0036 , C01B33/12 , C23C14/10 , C23C14/3485 , C23C14/35
Abstract: According to the invention there is a method of depositing SiO2 onto a substrate by pulsed DC reactive sputtering which uses a sputtering gas mixture consisting essentially of oxygen and krypton.
Abstract translation: 根据本发明,通过使用基本上由氧和氪组成的溅射气体混合物的脉冲DC反应溅射,将SiO 2沉积到衬底上的方法。